RFID System With an Eddy Current Trap

ABSTRACT

An RFID antenna assembly configured to be energized with a carrier signal is disclosed. The RFID antenna assembly includes an inductive component including a loop antenna assembly, at least one capacitive component coupled to the inductive component, and an eddy current trap positioned a predetermined distance from the loop antenna assembly.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 13/035,438, filed Feb. 25, 2011 and entitled RFID System withand Eddy Current Trap, now U.S. Pat. No. 9,270,010, issued Feb. 23, 2016(Attorney Docket No. 156), which claims priority to U.S. ProvisionalPatent Application Ser. No. 61/308,655, filed Feb. 26, 2010 and entitledRFID System With An Eddy Current Trap (Attorney Docket No. I01), whichis incorporated herein by reference in its entirety.

U.S. patent application Ser. No. 13/035,438, filed Feb. 25, 2011 andentitled RFID System with and Eddy Current Trap, now U.S. Pat. No.9,270,010, issued Feb. 23, 2016 (Attorney Docket No. 156) is also acontinuation-in-part of U.S. patent application Ser. No. 12/469,545,filed May 20, 2009, and entitled RFID System, now U.S. Pat. No.8,314,740, issued Nov. 20, 2012 (Attorney Docket No. H38) which is acontinuation-in-part of U.S. patent application Ser. No. 12/205,681,filed Sep. 5, 2008, entitled RFID System and Method, now U.S. Pat. No.8,325,045, issued Dec. 4, 2012 (Attorney Docket No. G43), which claimsthe benefit of U.S. Provisional Patent Application Ser. No. 61/092,396,filed Aug. 27, 2008, entitled RFID System and Method (Attorney DocketNo. G35); U.S. Provisional Patent Application Ser. No. 61/970,497, filedSep. 6, 2007, entitled RFID System and Method (Attorney Docket No. F44);and U.S. Provisional Patent Application Ser. No. 61/054,757, filed May20, 2008, entitled RFID System and Method (Attorney Docket No. F84), allof which are herein incorporated by reference in their entireties.

U.S. patent application Ser. No. 12/469,545 also claims the benefit ofU.S. Provisional Patent Application Ser. No. 61/168,364, filed Apr. 10,2009, entitled Systems, Devices, and Methods for Communication UsingSplit Ring Resonators (Attorney Docket No. H18), which is hereinincorporated by reference in its entirety.

TECHNICAL FIELD

This disclosure relates to an RFID system and, more particularly, to anRFID system including at least one loop antenna, at least one split ringresonator and at least one eddy current trap.

BACKGROUND

Processing systems may combine one or more ingredients to form aproduct. Unfortunately, such systems are often static in configurationand are only capable of generating a comparatively limited number ofproducts. While such systems may be capable of being reconfigured togenerate other products, such reconfiguration may require extensivechanges to mechanical/electrical/software systems.

For example, in order to make a different product, new components mayneed to be added, such as e.g., new valves, lines, manifolds, andsoftware subroutines. Such extensive modifications may be required dueto existing devices/processes within the processing system beingnon-reconfigurable and having a single dedicated use, thus requiringthat additional components be added to accomplish new tasks.

SUMMARY OF DISCLOSURE

In a first implementation, an RFID antenna assembly configured to beenergized with a carrier signal. The RFID antenna assembly includes aninductive component including a loop antenna assembly, at least onecapacitive component coupled to the inductive component, and an eddycurrent trap positioned a predetermined distance from the loop antennaassembly.

One or more of the following features may be included. The inductivecomponent may be configured to be positioned proximate a first slotassembly to detect the presence of a first RFID tag assembly within thefirst slot assembly and not detect the presence of a second RFID tagassembly within a second slot assembly that is adjacent to the firstslot assembly. The circumference of the loop antenna assembly may beapproximately 10% of the wavelength of the carrier signal.

The at least one capacitive component may include a first capacitivecomponent configured to couple a port on which the carrier signal isreceived and a ground. The at least one capacitive component may includea second capacitive component configured to couple the port on which thecarrier signal is received and the inductive component.

In another implementation, an RFID antenna assembly is configured to beenergized with a carrier signal. The RFID antenna assembly includes aninductive component having a loop antenna assembly. The circumference ofthe loop antenna assembly is no more than 25% of the wavelength of thecarrier signal. At least one capacitive component is coupled to theinductive component and an eddy current trap positioned a predetermineddistance from the loop antenna assembly.

One or more of the following features may be included. The inductivecomponent may be configured to be positioned proximate a first slotassembly to detect the presence of a first RFID tag assembly within thefirst slot assembly and not detect the presence of a second RFID tagassembly within a second slot assembly that is adjacent to the firstslot assembly. The circumference of the loop antenna assembly may beapproximately 10% of the wavelength of the carrier signal.

The at least one capacitive component may include a first capacitivecomponent configured to couple a port on which the carrier signal isreceived and a ground. The at least one capacitive component may includea second capacitive component configured to couple the port on which thecarrier signal is received and the inductive component.

In another implementation, an RFID antenna assembly is configured to beenergized with a carrier signal. The RFID antenna assembly includes aninductive component having a multi-segment loop antenna assembly. Themulti-segment loop antenna assembly includes: at least a first antennasegment having at least a first phase shift element configured to reducethe phase shift of the carrier signal within the at least a firstantenna segment. At least a second antenna segment includes at least asecond phase shift element configured to reduce the phase shift of thecarrier signal within the at least a second antenna segment. The lengthof each antenna segment is no more than 25% of the wavelength of thecarrier signal. At least one matching component is configured to adjustthe impedance of the multi-segment loop antenna assembly.

One or more of the following features may be included. The inductivecomponent may be configured to be positioned proximate an accessassembly and to allow RFID-based actuation of the access assembly. Atleast one of the first phase shift element and the second phase shiftelement may include a capacitive component. The length of each antennasegment may be approximately 10% of the wavelength of the carriersignal.

A first matching component may be configured to couple a port on whichthe carrier signal is received and a ground. The first matchingcomponent may include a capacitive component. A second matchingcomponent may be configured to couple the port on which the carriersignal is received and the inductive component. The second matchingcomponent may include a capacitive component.

In another implementation, a magnetic field focusing assembly includes amagnetic field generating device configured to generate a magneticfield, a split ring resonator assembly configured to be magneticallycoupled to the magnetic field generating device and configured to focusat least a portion of the magnetic field produced by the magnetic fieldgenerating device and an eddy current trap positioned a predetermineddistance from the magnetic field generating device.

One or more of the following features may be included. The magneticfield generating device may include an antenna assembly. The split ringresonator assembly may be constructed of a metamaterial. The split ringresonator assembly may be constructed of a non-ferrous material. Thesplit ring resonator assembly may be configured to be generally planarand have a geometric shape.

The magnetic field generating device may be configured to be energizedby a carrier signal having a defined frequency and the split ringresonator assembly may be configured to have a resonant frequency thatis approximately 5-10% higher than the defined frequency of the carriersignal.

The magnetic field generating device may be configured to be energizedwith a carrier signal and may include an inductive component including aloop antenna assembly. The circumference of the loop antenna assemblymay be no more than 25% of the wavelength of the carrier signal. Atleast one capacitive component may be coupled to the inductivecomponent.

The inductive component may be configured to be positioned proximate afirst slot assembly to detect the presence of a first RFID tag assemblywithin the first slot assembly and not detect the presence of a secondRFID tag assembly within a second slot assembly that is adjacent to thefirst slot assembly. The circumference of the loop antenna assembly maybe approximately 10% of the wavelength of the carrier signal. The atleast one capacitive component may include a first capacitive componentconfigured to couple a port on which the carrier signal is received anda ground. The at least one capacitive component may include a secondcapacitive component configured to couple the port on which the carriersignal is received and the inductive component.

The magnetic field generating device may be configured to be energizedwith a carrier signal and may include an inductive component including amulti-segment loop antenna assembly. The multi-segment loop antennaassembly may include at least a first antenna segment including at leasta first phase shift element configured to reduce the phase shift of thecarrier signal within the at least a first antenna segment. At least asecond antenna segment may include at least a second phase shift elementconfigured to reduce the phase shift of the carrier signal within the atleast a second antenna segment. The length of each antenna segment maybe no more than 25% of the wavelength of the carrier signal. At leastone matching component may be configured to adjust the impedance of themulti-segment loop antenna assembly.

The inductive component may be configured to be positioned proximate anaccess assembly and to allow RFID-based actuation of the accessassembly. At least one of the first phase shift element and the secondphase shift element may include a capacitive component. The length ofeach antenna segment may be approximately 10% of the wavelength of thecarrier signal. A first matching component may be configured to couple aport on which the carrier signal is received and a ground. The firstmatching component may include a capacitive component. A second matchingcomponent may be configured to couple the port on which the carriersignal is received and the inductive component. The second matchingcomponent may include a capacitive component.

In another implementation, an RFID antenna assembly is configured to beenergized with a carrier signal. The RFID antenna assembly includes aninductive component having a multi-segment loop antenna assembly. Themulti-segment loop antenna assembly includes at least a first antennasegment having at least a first phase shift element configured to reducethe phase shift of the carrier signal within the at least a firstantenna segment. At least a second antenna segment includes at least asecond phase shift element configured to reduce the phase shift of thecarrier signal within the at least a second antenna segment. The RFIDantenna assembly includes at least one far field antenna assembly. Thelength of each antenna segment is no more than 25% of the wavelength ofthe carrier signal. At least one matching component is configured toadjust the impedance of the multi-segment loop antenna assembly. Theassembly also includes an eddy current trap positioned a predetermineddistance from the multi-segment loop antenna assembly.

One or more of the following features may be included. The inductivecomponent may be configured to be positioned proximate an accessassembly of a processing system and to allow RFID-based actuation of theaccess assembly. The far field antenna assembly may be a dipole antennaassembly. The far field antenna assembly may include a first antennaportion and a second antenna portion. The sum length of the firstantenna portion and the second antenna portion may be greater than 25%of the wavelength of the carrier signal.

These aspects of the invention are not meant to be exclusive and otherfeatures, aspects, and advantages of the present invention will bereadily apparent to those of ordinary skill in the art when read inconjunction with the appended claims and accompanying drawings. Thedetails of one or more implementations are set forth in the accompanyingdrawings and the description below. Other features and advantages willbecome apparent from the description, the drawings and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features and advantages of the present invention will bebetter understood by reading the following detailed description, takentogether with the drawings wherein

FIG. 1 is a diagrammatic view of one embodiment of a processing system;

FIG. 2 is a diagrammatic view of one embodiment of a control logicsubsystem included within the processing system of FIG. 1;

FIG. 3 is a diagrammatic view of one embodiment of a high volumeingredient subsystem included within the processing system of FIG. 1;

FIG. 4 is a diagrammatic view of one embodiment of a micro ingredientsubsystem included within the processing system of FIG. 1;

FIG. 5 is a diagrammatic view of one embodiment of a plumbing/controlsubsystem included within the processing system of FIG. 1;

FIG. 6 is a diagrammatic view of one embodiment of a user interfacesubsystem included within the processing system of FIG. 1;

FIG. 7 is an isometric view of one embodiment of an RFID system includedwithin the processing system of FIG. 1;

FIG. 8A is a diagrammatic view of one embodiment of the RFID system ofFIG. 7;

FIG. 8B is another diagrammatic view of one embodiment of the RFIDsystem of FIG. 7;

FIG. 9 is a diagrammatic view of one embodiment of an RFID antennaassembly included within the RFID system of FIG. 7;

FIG. 10 is an isometric view of one embodiment of an antenna loopassembly of the RFID antenna assembly of FIG. 9;

FIG. 11A is an isometric view of one embodiment of a split ringresonator for use with the antenna loop assembly of FIG. 10;

FIGS. 11B1-11B16 are various flux plot diagrams illustrative of thelines of magnetic flux produced an inductive loop assembly without andwith a split ring resonator assembly at various phase angles of acarrier signal;

FIG. 11C is a diagrammatic view of one embodiment of the RFID system ofFIG. 7 including one embodiment of the split ring resonators of FIG. 11A;

FIG. 12A is one embodiment of a schematic diagram of an equivalentcircuit of the split ring resonator of FIG. 11 A;

FIG. 12B is one embodiment of a schematic diagram of a tuning circuitfor use with the split ring resonator of FIG. 11 A;

FIGS. 13A-13B are examples of alternative embodiments of the split ringresonator of FIG. 11 A;

FIG. 14 is one embodiment of an isometric view of a housing assembly forhousing the processing system of FIG. 1;

FIG. 15 A is one embodiment of a diagrammatic view of an RFID accessantenna assembly included within the processing system of FIG. 1;

FIG. 15B is one embodiment of a diagrammatic view of a split ringresonator for use with the RFID access antenna assembly of FIG. 15A;

FIG. 16A is a preferred embodiment of a diagrammatic view of the RFIDaccess antenna assembly of FIG. 15 A; and

FIG. 16B is a preferred embodiment of a diagrammatic view of a splitring resonator for use with the RFID access antenna assembly of FIG. 16A;

FIG. 17 is one embodiment of a schematic diagram of a tuning circuit foruse with the RFID access antenna assembly of FIGS. 15A & 15B;

FIG. 18A is a diagrammatic view of one embodiment of a current trap andantenna assembly;

FIG. 18B is a diagrammatic view of the Eddy Current Trap shown in FIG.18A;

FIG. 19 is a diagrammatic view of one embodiment of split ringresonators on a board;

FIGS. 20A-20G show testing results showing two loop antennas, accordingto one embodiment, with and without an Eddy Current Trap, according toone embodiment, installed; and

FIG. 21 shows one embodiment of a loop antenna.

Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Described herein is a product dispensing system. The system includes oneor more modular components, also termed “subsystems”. Although exemplarysystems are described herein, in various embodiments, the productdispensing system may include one or more of the subsystems described,but the product dispensing system is not limited to only one or more ofthe subsystems described herein. Thus, in some embodiments, additionalsubsystems may be used in the product dispensing system.

The following disclosure will discuss the interaction and cooperation ofvarious electrical components, mechanical components, electro-mechanicalcomponents, and software processes (i.e., “subsystems”) that allow forthe mixing and processing of various ingredients to form a product.Examples of such products may include but are not limited to:dairy-based products (e.g., milkshakes, floats, malts, frappes);coffee-based products (e.g., coffee, cappuccino, espresso); soda-basedproducts (e.g., floats, soda w/fruit juice); tea-based products (e.g.,iced tea, sweet tea, hot tea); water-based products (e.g., spring water,flavored spring water, spring water w/vitamins, high-electrolyte drinks,high-carbohydrate drinks); solid-based products (e.g., trail mix,granola-based products, mixed nuts, cereal products, mixed grainproducts); medicinal products (e.g., infusible medicants, injectablemedicants, ingestible medicants, dialysates); alcohol-based products(e.g., mixed drinks, wine spritzers, soda-based alcoholic drinks,water-based alcoholic drinks, beer with flavor “shots”); industrialproducts (e.g., solvents, paints, lubricants, stains); and health/beautyaid products (e.g., shampoos, cosmetics, soaps, hair conditioners, skintreatments, topical ointments).

The products may be produced using one or more “ingredients”.Ingredients may include one or more fluids, powders, solids or gases.The fluids, powders, solids, and/or gases may be reconstituted ordiluted within the context of processing and dispensing. The productsmay be a fluid, solid, powder or gas.

The various ingredients may be referred to as “macroingredients”,“microingredients”, or “large volume microingredients”. One or more ofthe ingredients used may be contained within a housing, i.e., part of aproduct dispensing machine. However, one or more of the ingredients maybe stored or produced outside the machine. For example, in someembodiments, water (in various qualities) or other ingredients used inhigh volume may be stored outside of the machine (for example, in someembodiments, high fructose corn syrup may be stored outside themachine), while other ingredients, for example, ingredients in powderform, concentrated ingredients, nutraceuticcals, pharmaceuticals and/orgas cylinders may be stored within the machine itself.

Various combinations of the above-referenced electrical components,mechanical components, electro-mechanical components, and softwareprocesses are discussed below. While combinations are described belowthat disclose e.g., the production of beverages and medicinal products(e.g., dialysates) using various subsystems, this is not intended to bea limitation of this disclosure, rather, exemplary embodiments of waysin which the subsystems may work together to create/dispense a product.Specifically, the electrical components, mechanical components,electromechanical components, and software processes (each of which willbe discussed below in greater detail) may be used to produce any of theabove-referenced products or any other products similar thereto.

Referring to FIG. 1, there is shown a generalized-view of processingsystem 10 that is shown to include a plurality of subsystems namely:storage subsystem 12, control logic subsystem 14, high volume ingredientsubsystem 16, microingredient subsystem 18, plumbing/control subsystem20, user interface subsystem 22, and nozzle 24. Each of the abovedescribes subsystems 12, 14, 16, 18, 20, 22 will be described below ingreater detail.

During use of processing system 10, user 26 may select a particularproduct 28 for dispensing (into container 30) using user interfacesubsystem 22. Via user interface subsystem 22, user 26 may select one ormore options for inclusion within such product. For example, options mayinclude but are not limited to the addition of one or more ingredients.In one exemplary embodiment, the system is a system for dispensing abeverage. In this embodiment, the use may select various flavorings(e.g. including but not limited to lemon flavoring, lime flavoring,chocolate flavoring, and vanilla flavoring) into a beverage; theaddition of one or more nutraceuticals (e.g. including but not limitedto Vitamin A, Vitamin C, Vitamin D, Vitamin E, Vitamin B₆, Vitamin Bi₂,and Zinc) into a beverage; the addition of one or more other beverages(e.g. including but not limited to coffee, milk, lemonade, and iced tea)into a beverage; and the addition of one or more food products (e.g. icecream, yogurt) into a beverage.

Once user 26 makes the appropriate selections, via user interfacesubsystem 22, user interface subsystem 22 may send the appropriate datasignals (via data bus 32) to control logic subsystem 14. Control logicsubsystem 14 may process these data signals and may retrieve (via databus 34) one or more recipes chosen from plurality of recipes 36maintained on storage subsystem 12. The term “recipe” refers toinstructions for processing/creating the requested product. Uponretrieving the recipe(s) from storage subsystem 12, control logicsubsystem 14 may process the recipe(s) and provide the appropriatecontrol signals (via data bus 38) to e.g. high volume ingredientsubsystem 16 microingredient subsystem 18 (and, in some embodiments,large volume microingredients, not shown, which may be included in thedescription with respect to microingredients with respect to processing.With respect to the subsystems for dispensing these large volumemicroingredients, in some embodiments, an alternate assembly from themicroingredient assembly, may be used to dispense these large volumemicroingredients), and plumbing/control subsystem 20, resulting in theproduction of product 28 (which is dispensed into container 30).

Referring also to FIG. 2, a diagrammatic view of control logic subsystem14 is shown. Control logic subsystem 14 may include microprocessor 100(e.g., an ARM microprocessor produced by Intel Corporation of SantaClara, Calif.), nonvolatile memory (e.g. read only memory 102), andvolatile memory (e.g. random access memory 104); each of which may beinterconnected via one or more data/system buses 106, 108. As discussedabove, user interface subsystem 22 may be coupled to control logicsubsystem 14 via data bus 32.

Control logic subsystem 14 may also include an audio subsystem 110 forproviding e.g. an analog audio signal to speaker 112, which may beincorporated into processing system 10. Audio subsystem 110 may becoupled to microprocessor 100 via data/system bus 114.

Control logic subsystem 14 may execute an operating system, examples ofwhich may include but are not limited to Microsoft Windows CE™, RedhatLinux™, Palm OS™, or a device-specific (i.e., custom) operating system.

The instruction sets and subroutines of the above-described operatingsystem, which may be stored on storage subsystem 12, may be executed byone or more processors (e.g. microprocessor 100) and one or more memoryarchitectures (e.g. readonly memory 102 and/or random access memory 104)incorporated into control logic subsystem 14.

Storage subsystem 12 may include, for example, a hard disk drive, anoptical drive, a random access memory (RAM), a read-only memory (ROM), aCF (i.e., compact flash) card, an SD (i.e., secure digital) card, aSmartMedia card, a Memory Stick, and a MultiMedia card, for example.

As discussed above, storage subsystem 12 may be coupled to control logicsubsystem 14 via data bus 34. Control logic subsystem 14 may alsoinclude storage controller 116 (shown in phantom) for converting signalsprovided by microprocessor 100 into a format usable by storage system12. Further, storage controller 116 may convert signals provided bystorage subsystem 12 into a format usable by microprocessor 100. In someembodiments, an Ethernet connection may also be included.

As discussed above, high-volume ingredient subsystem 16 (also referredto herein as “macroingredients”), microingredient subsystem 18 and/orplumbing/control subsystem 20 may be coupled to control logic subsystem14 via data bus 38. Control logic subsystem 14 may include bus interface118 (shown in phantom) for converting signals provided by microprocessor100 into a format usable by high-volume ingredient subsystem 16,microingredient subsystem 18 and/or plumbing/control subsystem 20.Further, bus interface 118 may convert signals provided by high-volumeingredient subsystem 16, microingredient subsystem 18 and/orplumbing/control subsystem 20 into a format usable by microprocessor100.

As will be discussed below in greater detail, control logic subsystem 14may execute one or more control processes 120 that may control theoperation of processing system 10. The instruction sets and subroutinesof control processes 120, which may be stored on storage subsystem 12,may be executed by one or more processors (e.g. microprocessor 100) andone or more memory architectures (e.g. read-only memory 102 and/orrandom access memory 104) incorporated into control logic subsystem 14.

Referring also to FIG. 3, a diagrammatic view of high-volume ingredientsubsystem 16 and plumbing/control subsystem 20 are shown. High-volumeingredient subsystem 16 may include containers for housing consumablesthat are used at a rapid rate when making product 28. For example,high-volume ingredient subsystem 16 may include carbon dioxide supply150, water supply 152, and high fructose corn syrup supply 154. Thehigh-volume ingredients, in some embodiments, may be located withinclose proximity to the other subsystems. An example of carbon dioxidesupply 150 may include but is not limited to a tank (not shown) ofcompressed, gaseous carbon dioxide. An example of water supply 152 mayinclude but is not limited to a municipal water supply (not shown), adistilled water supply, a filtered water supply, a reverse-osmosis(“RO”) water supply, or other desired water supply. An example of highfructose corn syrup supply 154 may include but is not limited to one ormore tank(s) (not shown) of highly-concentrated, high fructose cornsyrup, or one or more bag-in-box packages of high-fructose corn syrup.

High-volume, ingredient subsystem 16 may include a carbonator 156 forgenerating carbonated water from carbon dioxide gas (provided by carbondioxide supply 150) and water (provided by water supply 152). Carbonatedwater 158, water 160 and high fructose corn syrup 162 may be provided tocold plate assembly 163 e.g., in embodiments where a product is beingdispensed in which it may be desired to be cooled. In some embodiments,the cold plate assembly may not be included as part of the dispensingsystems or may be bypassed. Cold plate assembly 163 may be designed tochill carbonated water 158, water 160, and high fructose corn syrup 162down to a desired serving temperature (e.g. 40° F.).

While a single cold plate assembly 163 is shown to chill carbonatedwater 158, water 160, and high fructose corn syrup 162, this is forillustrative purposes only and is not intended to be a limitation ofdisclosure, as other configurations are possible. For example, anindividual cold plate assembly may be used to chill each of carbonatedwater 158, water 160 and high fructose corn syrup 162. Once chilled,chilled carbonated water 164, chilled water 166, and chilled highfructose corn syrup 168 may be provided to plumbing/control subsystem20. And in still other embodiments, a cold plate may not be included. Insome embodiments, at least one hot plate may be included.

Although the plumbing is depicted as having the order shown, in someembodiments, this order is not used. For example, the flow controlmodules described herein may be configured in a different order, i.e.,flow measuring device, binary valve and then variable line impendence.

For descriptive purposes, the system will be described below withreference to using the system to dispense soft drinks as a product,i.e., the macroingredients/high-volume ingredients described willinclude high-fructose corn syrup, carbonated water and water. However,in other embodiments of the dispensing system, the macroingredientsthemselves, and the number of macroingredients, may vary.

For illustrative purposes, plumbing/control subsystem 20 is shown toinclude three flow measuring devices 170, 172, 174, which measure thevolume of chilled carbonated water 164, chilled water 166 and chilledhigh fructose corn syrup 168 (respectively). Flow measuring devices 170,172, 174 may provide feedback signals 176, 178, 180 (respectively) tofeedback controller systems 182, 184, 186 (respectively).

Feedback controller systems 182, 184, 186 (which will be discussed belowin greater detail) may compare flow feedback signals 176, 178, 180 tothe desired flow volume (as defined for each of chilled carbonated water164, chilled water 166 and chilled high fructose corn syrup 168;respectively). Upon processing flow feedback signals 176, 178, 180,feedback controller systems 182, 184, 186 (respectively) may generateflow control signals 188, 190, 192 (respectively) that may be providedto variable line impedances 194, 196, 198 (respectively). An example ofvariable line impedance 194, 196, 198 is disclosed and claimed in U.S.Pat. No. 5,755,683 (which is herein incorporated by reference in itsentirety) and U.S. Publication No.: 2007/0085049 (which is hereinincorporated by reference in its entirety). Variable line impedances194, 196, 198 may regulate the flow of chilled carbonated water 164,chilled water 166 and chilled high fructose corn syrup 168 passingthrough lines 206, 208, 210 (respectively), which are provided to nozzle24 and (subsequently) container 30. However, additional embodiments ofthe variable line impedances are described herein.

Lines 206, 208, 210 may additionally include solenoid valves 200, 202,204 (respectively) for preventing the flow of fluid through lines 206,208, 210 during times when fluid flow is not desired/required (e.g.during shipping, maintenance procedures, and downtime).

As discussed above, FIG. 3 merely provides an illustrative view ofplumbing control subsystem 20. Accordingly, the manner in whichplumbing/control subsystem 20 is illustrated is not intended to be alimitation of this disclosure, as other configurations are possible. Forexample, some or all of the functionality of feedback controller systems182, 184, 186 may be incorporated into control logic subsystem 14.

Referring also to FIG. 4, a diagrammatic top-view of microingredientsubsystem 18 and plumbing/control subsystem 20 is shown. Microingredientsubsystem 18 may include product module assembly 250, which may beconfigured to releasably engage one or more product containers 252, 254,256, 258, which may be configured to hold microingredients for use whenmaking product 28. The microingredients may be substrates that may beused in making the product Examples of such micro ingredients/substratesmay include but are not limited to a first portion of a soft drinkflavoring, a second portion of a soft drink flavoring, coffee flavoring,nutraceuticals, and pharmaceuticals; and may be fluids, powders orsolids. However and for illustrative purposes, the description belowrefers to microingredients that are fluids. In some embodiments, themicroingredients may be powders or solids. Where a microingredient is apowder, the system may include an additional subsystem for metering thepowder and/or reconstituting the powder (although, as described inexamples below, where the microingredient is a powder, the powder may bereconstituted as part of the methods of mixing the product.

Product module assembly 250 may include a plurality of slot assemblies260, 262, 264, 266 configured to releasably engage plurality of productcontainers 252, 254, 256, 258. In this particular example, productmodule assembly 250 is shown to include four slot assemblies (namelyslots 260, 262, 264, 266) and, therefore, may be referred to as a quadproduct module assembly. When positioning one or more of productcontainers 252, 254, 256, 258 within product module assembly 250, aproduct container (e.g. product container 254) may be slid into a slotassembly (e.g. slot assembly 262) in the direction of arrow 268.Although as shown herein, in the exemplary embodiment, a “quad productmodule” assembly is described, in other embodiments, more or lessproduct may be contained within a module assembly Depending on theproduct being dispensed by the dispensing system, the numbers of productcontainers may vary. Thus, the numbers of product contained within anymodule assembly may be application specific, and may be selected tosatisfy any desired characteristic of the system, including, but notlimited to, efficiency, necessity and/or function of the system.

For illustrative purposes, each slot assembly of product module assembly250 is shown to include a pump assembly. For example, slot assembly 252shown to include pump assembly 270; slot assembly 262 shown to includepump assembly 272; slot assembly 264 is shown to include pump assembly274; and slot assembly 266 is shown to include pump assembly 276.

Each of pump assemblies 270, 272, 274, 276 may include an inlet port forreleasably engaging a product orifice included within the productcontainer. For example, pump assembly 272 a shown to include inlet port278 that is configured to releasably engage container orifice 280included within product container 254. Inlet port 278 and/or productorifice 280 may include one or more sealing assemblies (e.g., one ormore o-rings/luer fittings; not shown) to facilitate a leakproof seal.

An example of one or more of pump assembly 270, 272, 274, 276 mayinclude but is not limited to a solenoid piston pump assembly thatprovides a defined and consistent amount of fluid each time that one ormore of pump assemblies 270, 272, 274, 276 are energized. In oneembodiment, such pumps are available from ULKA CostruzioniElettromeccaniche S.p.A. of Pavia, Italy. For example, each time a pumpassembly (e.g. pump assembly 274) is energized by control logicsubsystem 14 via data bus 38, the pump assembly may provide a calibratedvolume of the root beer flavoring included within product container 256.Again, for illustrative purposes only, the microingredients are fluidsin this section of the description.

Other examples of pump assemblies 270, 272, 274, 276 and various pumpingtechniques are described in U.S. Pat. No. 4,808,161 (which is hereinincorporated by reference in its entirety); U.S. Pat. No. 4,826,482(which is herein incorporated by reference in its entirety); U.S. Pat.No. 4,976,162 (which is herein incorporated by reference in itsentirety); U.S. Pat. No. 5,088,515 (which is herein incorporated byreference in its entirety); and U.S. Pat. No. 5,350,357 (which is hereinincorporated by reference in its entirety). In some embodiments, thepump assembly may be any of the pump assemblies and may use any of thepump techniques described in U.S. Pat. No. 5,421,823 (which is hereinincorporated by reference in its entirety).

The above-cited references describe non-limiting examples ofpneumatically actuated membrane-based pumps that may be used to pumpfluids. A pump assembly based on a pneumatically actuated membrane maybe advantageous, for one or more reasons, including but not limited to,ability to deliver quantities, for example, microliter quantities, offluids of various compositions reliably and precisely over a largenumber of duty cycles; and/or because the pneumatically actuated pumpmay require less electrical power because it may use pneumatic power,for example, from a carbon dioxide source. Additionally, amembrane-based pump may not require a dynamic seal, in which the surfacemoves with respect to the seal. Vibratory pumps such as thosemanufactured by ULKA generally require the use of dynamic elastomericseals, which may fail over time for example, after exposure to certaintypes of fluids and/or wear. In some embodiments, pneumatically-actuatedmembrane-based pumps may be more reliable, cost effective and easier tocalibrate than other pumps. They may also produce less noise, generateless heat and consume less power than other pumps.

Product module assembly 250 may be configured to releasably engagebracket assembly 282. Bracket assembly 282 may be a portion of (andrigidly fixed within) processing system 10. Although referred to hereinas a “bracket assembly”, the assembly may vary in other embodiments. Thebracket assembly serves to secure the product module assembly 250 in adesired location. An example of bracket assembly 282 may include but isnot limited to a shelf within processing system 10 that is configured toreleasably engage product module assembly 250. For example, productmodule assembly 250 may include a engagement device (e.g. a clipassembly, a slot assembly, a latch assembly, a pin assembly; not shown)that is configured to releasably engage a complementary device that isincorporated into bracket assembly 282.

Plumbing/control subsystem 20 may include manifold assembly 284 that maybe rigidly affixed to bracket assembly 282. Manifold assembly 284 may beconfigured to include a plurality of inlet ports 286, 288, 290, 292 thatare configured to releasably engage a pump orifice (e.g. pump orifices294, 296, 298, 300) incorporated into each of pump assemblies 270, 272,274, 276. When positioning product module assembly 250 on bracketassembly 282, product module assembly 250 may be moved in the directionof the arrow 302, thus allowing for inlet ports 286, 288, 290, 292 toreleasably engage pump orifices 294, 296, 298, 300. Inlet ports 286,288, 290, 292 and/or pump orifices 294, 296, 298, 300 may include one ormore O-ring or other sealing assemblies as described above (not shown)to facilitate a leakproof seal.

Manifold assembly 284 may be configured to engage tubing bundle 304,which may be plumbed (either directly or indirectly) to nozzle 24. Asdiscussed above, high-volume ingredient subsystem 16 also providesfluids in the form of, in at least one embodiment, chilled carbonatedwater 164, chilled water 166 and/or chilled high fructose corn syrup 168(either directly or indirectly) to nozzle 24. Accordingly, as controllogic subsystem 14 may regulate (in this particular example) thespecific quantities of the various high-volume ingredients e.g. chilledcarbonated water 164, chilled water 166, chilled high fructose cornsyrup 168 and the quantities of the various microingredients (e.g. afirst substrate (i.e., flavoring), a second substrate (i.e., anutraceutical), and a third substrate (i.e., a pharmaceutical), controllogic subsystem 14 may accurately control the makeup of product 28.

Although FIG. 4 depicts only one nozzle 24, in various otherembodiments, multiple nozzles may be included. In some embodiments, morethan one container 30 may receive product dispensed from the system viae.g., more than one set of tubing bundles. Thus, in some embodiments,the dispensing system may be configured such that one or more users mayrequest one or more products to be dispensed concurrently.

Referring also to FIG. 5, a diagrammatic view of plumbing/controlsubsystem 20 is shown. While the plumbing/control subsystem describedbelow concerns the plumbing/control system used to control the quantityof chilled carbonated water 164 being added to product 28, this is forillustrative purposes only and is not intended to be a limitation ofthis disclosure, as other configurations are also possible. For example,the plumbing/control subsystem described below may also be used tocontrol e.g., the quantity of chilled water 166 and/or chilled highfructose corn syrup 168 being added to product 28.

As discussed above, plumbing/control subsystem 20 may include feedbackcontroller system 182 that receives flow feedback signal 176 from flowmeasuring device 170. Feedback controller system 182 may compare flowfeedback signal 176 to the desired flow volume (as defined by controllogic subsystem 14 via data bus 38). Upon processing flow feedbacksignal 176, feedback controller system 182 may generate flow controlsignal 188 that may be provided to variable line impedance 194.

Feedback controller system 182 may include trajectory shaping controller350, flow controller 352, feed forward controller 354, unit delay 356,saturation controller 358, and stepper controller 360, each of whichwill be discussed below in greater detail.

Trajectory shaping controller 350 may be configured to receive a controlsignal from control logic subsystem 14 via data bus 38. This controlsignal may define a trajectory for the manner in which plumbing/controlsubsystem 20 is supposed to deliver fluid (in the case, chilledcarbonated water 164) for use in product 28. However, the trajectoryprovided by control logic subsystem 14 may need to be modified prior tobeing processed by e.g., flow controller 352. For example, controlsystems tend to have a difficult time processing control curves that aremade up of a plurality of linear line segments (i.e., that include stepchanges). For example, flow regulator 352 may have difficulty processingcontrol curve 370, as it consists of three distinct linear segments,namely segments 372, 374, 376. Accordingly, at the transition points(e.g., transition points 378, 380), flow controller 352 specifically(and plumbing/control subsystem 20 generally) would be required toinstantaneously change from a first flow rate to a second flow rate.Therefore, trajectory shaping controller 350 may filter control curve 30to form smoothed control curve 382 that is more easily processed by flowcontroller 352 specifically (and plumbing/control subsystem 20generally), as an instantaneous transition from a first flow rate to asecond flow rate is no longer required.

Additionally, trajectory shaping controller 350 may allow for thepre-fill wetting and post-fill rinsing of nozzle 24. In some embodimentsand/or for some recipes, one or more ingredients may present problemsfor nozzle 24 if the ingredient (referred to herein as “dirtyingredients”) contacts nozzle 24 directly i.e., in the form in which itis stored. In some embodiments, nozzle 24 may be pre-fill wetted with a“pre-fill” ingredient e.g., water, so as to prevent the direct contactof these “dirty ingredients” with nozzle 24. Nozzle 24 may then bepost-fill rinsed with a “post-wash ingredient” e.g., water.

Specifically, in the event that nozzle 24 is pre-fill wetted with e.g.,10 mL of water (or any “pre-fill” ingredient), and/or post-fill rinsedwith e.g., 10 mL of water (or any “post-wash” ingredient), once theadding of the dirty ingredient has stopped, trajectory shapingcontroller 350 may offset the pre-wash ingredient added during thepre-fill wetting and/or post-fill rinsing by providing an additionalquantity of dirty ingredient during the fill process. Specifically, ascontainer 30 is being filled with product 28, the pre-fill rinse wateror “pre-wash” may result in product 28 being initiallyunder-concentrated with a the dirty ingredient, Trajectory shapingcontroller 350 may then add dirty ingredient at a higher-than-neededflow rate, resulting in product 28 transitioning from“under-concentrated” to “appropriately concentrated” to“over-concentrated”, or present in a concentration higher than thatwhich is called for by the particular recipe. However, once theappropriate amount of dirty ingredient has been added, the post-fillrinse process may add additional water, or another appropriate“post-wash ingredient”, resulting in product 28 once again becoming“appropriately-concentrated” with the dirty ingredient.

Flow controller 352 may be configured as a proportional-integral (PI)loop controller. Flow controller 352 may perform the comparison andprocessing that was generally described above as being performed byfeedback controller system 182. For example, flow controller 352 may beconfigured to receive feedback signal 176 from flow measuring device170. Flow controller 352 may compare flow feedback signal 176 to thedesired flow volume (as defined by control logic subsystem 14 andmodified by trajectory shaping controller 350). Upon processing flowfeedback signal 176, flow controller 352 may generate flow controlsignal 188 that may be provided to variable line impedance 194.

Feed forward controller 354 may provide an “best guess” estimateconcerning what the initial position of variable line impedance 194should be. Specifically, assume that at a defined constant pressure,variable line impedance has a flow rate (for chilled carbonated water164) of between 0.00 mL/second and 120.00 mL/second. Further, assumethat a flow rate of 40 mL/second is desired when filing container 30with product 28. Accordingly, feed forward controller 354 may provide afeed forward signal (on feed forward line 384) that initially opensvariable line impedance 194 to 33.33% of its maximum opening (assumingthat variable line impedance 194 operates in a linear fashion).

When determining the value of the feed forward signal, feed forwardcontroller 354 may utilize a lookup table (not shown) that may bedeveloped empirically and may define the signal to be provided forvarious initial flow rates. An example such a lookup table may include,but is not limited to, the following table:

FIOWratemL/second Signal to stepper controller 0 pulse to 0 degrees 20pulse to 30 degrees 40 pulse to 60 degrees 60 pulse to 150 degrees 80pulse to 240 degrees 100 pulse to 270 degrees 120 pulse to 300 degrees

Again, assuming that a flow rate of 40 mL/second is desired when filingcontainer 30 with product 28, feed forward controller 354 may utilizethe above-described lookup table and may pulse the stepper motor to 60.0degrees (using feed forward line 384).

Unit delay 356 may form a feedback path through which a previous versionof the control signal (provided to variable line impedance 194) isprovided to flow controller 352.

Saturation controller 358 may be configured to disable the integralcontrol of feedback controller system 182 (which, as discussed above,may be configured as a PI loop controller) whenever variable lineimpedance 194 is set to a maximum flow rate (by stepper controller 360),thus increasing the stability of the system by reducing flow rateovershoots and system oscillations.

Stepper controller 360 may be configured to convert the signal providedby saturation controller 358 (on line 386) into a signal usable byvariable line impedance 194. Variable line impedance 194 may include astepper motor for adjusting the orifice size (and, therefore, the flowrate) of variable line impedance 194. Accordingly, control signal 188may be configured to control the stepper motor included within variableline impedance.

Referring also to FIG. 6, a diagrammatic view of user interfacesubsystem 22 is shown. User interface subsystem 22 may include touchscreen interface 400 that allows user 26 to select various optionsconcerning product 28. For example, user 26 (via “drink size” column402) may be able to select the size of product 28. Examples of theselectable sizes may include but are not limited to: “12 ounce”; “16ounce”; “20 ounce”; “24 ounce”; “32 ounce”; and “48 ounce”.

User 26 may be able to select (via “drink type” column 404) the type ofproduct 28. Examples of the selectable types may include but are notlimited to: “cola”; “lemon-lime”; “root beer”; “iced tea”; “lemonade”;and “fruit punch”.

User 26 may also be able to select (via “add-ins” column 406) one ormore flavorings/products for inclusion within product 28. Examples ofthe selectable add-ins may include but are not limited to: “cherryflavor”; “lemon flavor”; “lime flavor”; “chocolate flavor”; “coffeeflavor”; and “ice cream”.

Further, user 26 may be able to select (via “nutraceuticals” column 408)one or more nutraceuticals for inclusion within product 28. Examples ofsuch nutraceuticals may include but are not limited to: “Vitamin A”;“Vitamin Be”; “Vitamin Bi₂”; “Vitamin C”; “Vitamin D”; and “Zinc”.

In some embodiments, an additional screen at a level lower than thetouch screen may include a “remote control” (not shown) for the screen.The remote control may include buttons indicating up, down, left andright and select, for example. However, in other embodiments, additionalbuttons may be included.

Once user 26 has made the appropriate selections, user 26 may select“GO!” button 410 and user interface subsystem 22 may provide theappropriate data signals (via data bus 32) to control logic subsystem14. Once received, control logic subsystem 14 may retrieve theappropriate data from storage subsystem 12 and may provide theappropriate control signals to e.g., high volume ingredient subsystem16, microingredient subsystem 18, and plumbing/control subsystem 20,which may be processed (in the manner discussed above) to prepareproduct 28. Alternatively, user 26 may select “Cancel” button 412 andtouch screen interface 400 may be reset to a default state (e.g., nobuttons selected).

User interface subsystem 22 may be configured to allow for bidirectionalcommunication with user 26. For example, user interface subsystem 22 mayinclude informational screen 414 that allows processing system 10 toprovide information to user 26. Examples of the types of informationthat may be provided to user 26 may include but is not limited toadvertisements, information concerning system malfunctions/warnings, andinformation concerning the cost of various products.

As discussed above, product module assembly 250 (of microingredientsubsystem 18 and plumbing/control subsystem 20) may include a pluralityof slot assemblies 260, 262, 264, 266 configured to releasably engage aplurality of product containers 252, 254, 256, 258. Unfortunately, whenservicing processing system 10 to refill product containers 252, 254,256, 258, it may be possible to install a product container within thewrong slot assembly of product module assembly 250. A mistake such asthis may result in one or more pump assemblies (e.g., pump assemblies270, 272, 274, 276) and/or one or more tubing assemblies (e.g., tubingbundle 304) being contaminated with one or more microingredients. Forexample, as root beer flavoring (i.e., the microingredient containedwithin product container 256) has a very strong taste, once a particularpump assembly/tubing assembly is used to distribute e.g., root beerflavoring, it can no longer be used to distribute a microingredienthaving a less-strong taste (e.g., lemon-lime flavoring, iced teaflavoring, and lemonade flavoring).

Additionally and as discussed above, product module assembly 250 may beconfigured to releasably engage bracket assembly 282. Accordingly, inthe event that processing system 10 includes multiple product moduleassemblies and multiple bracket assemblies, when servicing processingsystem 10, it may be possible to install a product module assembly ontothe wrong bracket assembly. Unfortunately, such a mistake may alsoresult in one or more pump assemblies (e.g., pump assemblies 270, 272,274, 276) and/or one or more tubing assemblies (e.g., tubing bundle 304)being contaminated with one or more microingredients.

Accordingly, processing system 10 may include an RFID-based system toensure the proper placement of product containers and product moduleswithin processing system 10. Referring also to FIGS. 7 & 8A, processingsystem 10 may include RFID system 450 that may include RFID antennaassembly 452 positioned on product module assembly 250 of processingsystem 10.

As discussed above, product module assembly 250 may be configured toreleasably engage at least one product container (e.g., productcontainer 258). RFID system 450 may include RFID tag assembly 454positioned on (e.g., affixed to) product container 258. Whenever productmodule assembly 250 releasably engages the product container (e.g.,product container 258), RFID tag assembly 454 may be positioned withine.g., upper detection zone 456 of RFID antenna assembly 452. Accordinglyand in this example, whenever product container 258 is positioned within(i.e. releasably engages) product module assembly 250, RFID tag assembly454 should be detected by RFID antenna assembly 452.

As discussed above, product module assembly 250 may be configured toreleasably engage bracket assembly 282. RFID system 450 may furtherinclude RFID tag assembly 458 positioned on (e.g. affixed to) bracketassembly 282. Whenever bracket assembly 282 releasably engages productmodule assembly 250, RFID tag assembly 458 may be positioned withine.g., lower detection zone 460 of RFID antenna assembly 452.

Accordingly, through use of RFID antenna assembly 452 and RFID tagassemblies 454, 458, RFID system 450 may be able to determine whether ornot the various product containers (e.g., product containers 252, 254,256, 258) are properly positioned within product module assembly 250.Further, RFID system 450 may be able to determine whether or not productmodule assembly 250 is properly positioned within processing system 10.

While RFID system 450 shown to include one RFID antenna assembly and twoRFID tag assemblies, this is for illustrative purposes only and is notintended to be a limitation of this disclosure, as other configurationsare possible. Specifically, a typical configuration of RFID system 450may include one RFID antenna assembly positioned within each slotassembly of product module assembly 250. For example, RFID system 450may additionally include RFID antenna assemblies 462, 464, 466positioned within product module assembly 250. Accordingly, RFID antennaassembly 452 may determine whether a product container is inserted intoslot assembly 266 (of product module assembly 250); RFID antennaassembly 462 may determine whether a product container is inserted intoslot assembly 264 (of product module assembly 250); RFID antennaassembly 464 may determine whether a product container is inserted intoslot assembly 262 (of product module assembly 250); and RFID antennaassembly 466 may determine whether a product container is inserted intoslot assembly 260 (of product module assembly 250). Further, sinceprocessing system 10 may include multiple product module assemblies,each of these product module assemblies may include one or more RFIDantenna assemblies to determine which product containers are insertedinto the particular product module assembly.

As discussed above, by monitoring for the presence of an RFID tagassembly within lower detection zone 460 of RFID antenna assembly 452,RFID system 450 may be able to determine whether product module assembly250 is properly positioned within processing system 10. Accordingly, anyof RFID antenna assemblies 452, 462, 464, 466 may be utilized to readone or more RFID tag assemblies affixed to bracket assembly 282. Forillustrative purposes, bracket assembly 282 is shown to include only asingle RFID tag assembly 458. However, this is for illustrative purposesonly and is not intended to be a limitation of this disclosure, as otherconfigurations are possible. For example, bracket assembly 282 mayinclude multiple RFID tag assemblies, namely RFID tag assembly 468(shown in phantom) for being read by RFID antenna assembly 462; RFID tagassembly 470 (shown in phantom) for being read by RFID antenna assembly464; and RFID tag assembly 472 (shown in phantom) for being read by RFIDantenna assembly 466.

One or more of the RFID tag assemblies (e.g., RFID tag assemblies 454,458, 468, 470, 472) may be passive RFID tag assemblies (e.g., RFID tagassemblies that do not require a power source). Additionally, one ormore of the RFID tag assemblies (e.g., RFID tag assemblies 454, 458,468, 470, 472) may be a writeable RFID tag assembly, in that RFID system450 may write data to the RFID tag assembly. Examples of the type ofdata storable within the RFID tag assemblies may include, but is notlimited to: a quantity identifier for the product container, aproduction date identifier for the product container, a discard dateidentifier for the product container, an ingredient identifier for theproduct container, a product module identifier, and a bracketidentifier.

With respect to the quantity identifier, in some embodiments, eachvolume of ingredient pumped from a container including an RFID tag, theRFID tag is written to include the updated volume in the container,and/or, the amount pumped. Where the container is subsequently removedfrom the assembly, and replaced into a different assembly, the systemmay read the RFID tag and may know the volume in the container and/orthe amount that has been pumped from the container. Additionally, thedates of pumping may also be written on the RFID tag.

Accordingly, when each of the bracket assemblies (e.g. bracket assembly282) is installed within processing system 10, an RFID tag assembly(e.g. RFID tag assembly 458) may be attached, wherein the attached RFIDtag assembly may define a bracket identifier (for uniquely identifyingthe bracket assembly). Accordingly, if processing system 10 includes tenbracket assemblies, ten RFID tag assemblies (i.e., one attached to eachbracket assembly) may define ten unique bracket identifiers (i.e. onefor each bracket assembly).

Further, when a product container (e.g. product container 252, 254, 256,258) is manufactured and filled with a microingredient, an RFID tagassembly may include: an ingredient identifier (for identifying themicroingredient within the product container); a quantity identifier(for identifying the quantity of microingredient within the productcontainer); a production date identifier (for identifying the date ofmanufacture of the microingredient); and a discard date identifier (foridentifying the date on which the product container should bediscarded/recycled).

Accordingly, when product module assembly 250 is installed withinprocessing system 10, RFID antenna assemblies 452, 462, 464, 466 may beenergized by RFID subsystem 474. RFID subsystem 474 may be coupled tocontrol logic subsystem 14 via databus 476. Once energized, RFID antennaassemblies 452, 462, 464, 466 may begin scanning their respective upperand lower detection zones (e.g. upper detection zone 456 and lowerdetection zone 460) for the presence of RFID tag assemblies.

As discussed above, one or more RFID tag assemblies may be attached tothe bracket assembly with which product module assembly 250 releasablyengages. Accordingly, when product module assembly 250 is slid onto(i.e. releasably engages) bracket assembly 282, one or more of RFID tagassemblies 458, 468, 470, 472 may be positioned within the lowerdetection zones of RFID antenna assemblies 452, 462, 464, 466(respectively). Assume, for illustrative purposes, that bracket assembly282 includes only one RFID tag assembly, namely RFID tag assembly 458.Further, assume for illustrative purposes that product containers 252,254, 256, 258 are being installed within slot assemblies 260, 262, 264,266 (respectively). Accordingly, RFID subsystem 474 should detectbracket assembly 282 (by detecting RFID tag assembly 458) and shoulddetect product containers 252, 254, 256, 258 by detecting the RFID tagassemblies (e.g., RFID tag assembly 454) installed on each productcontainer.

The location information concerning the various product modules, bracketassemblies, and product containers, may be stored within e.g. storagesubsystem 12 that is coupled to control logic subsystem 14.Specifically, if nothing has changed, RFID subsystem 474 should expectto have RFID antenna assembly 452 detect RFID tag assembly 454 (i.e.which is attached to product container 258) and should expect to haveRFID antenna assembly 452 detect RFID tag assembly 458 (i.e. which isattached to bracket assembly 282). Additionally, if nothing has changed:RFID antenna assembly 462 should detect the RFID tag assembly (notshown) attached to product container 256; RFID antenna assembly 464should detect the RFID tag assembly (not shown) attached to productcontainer 254; and RFID antenna assembly 466 should detect the RFID tagassembly (not shown) attached to product container 252.

Assume for illustrative purposes that, during a routine service call,product container 258 is incorrectly positioned within slot assembly 264and product container 256 is incorrectly positioned within slot assembly266. Upon acquiring the information included within the RFID tagassemblies (using the RFID antenna assemblies), RFID subsystem 474 maydetect the RFID tag assembly associated with product container 258 usingRFID antenna assembly 262; and may detect the RFID tag assemblyassociated with product container 256 using RFID antenna assembly 452.Upon comparing the new locations of product containers 256, 258 with thepreviously stored locations of product containers 256, 258 (as stored onstorage subsystem 12), RFID subsystem 474 may determine that thelocation of each of these product containers is incorrect.

Accordingly, RFID subsystem 474, via control logic subsystem 14, mayrender a warning message on e.g. informational screen 414 ofuser-interface subsystem 22, explaining to e.g. the service technicianthat the product containers were incorrectly reinstalled. Depending onthe types of microingredients within the product containers, the servicetechnician may be e.g. given the option to continue or told that theycannot continue. As discussed above, certain microingredients (e.g. rootbeer flavoring) have such a strong taste that once they have beendistributed through a particular pump assembly and/or tubing assembly,the pump assembly/tubing assembly can no longer be used for any othermicroingredient. Additionally and as discussed above, the various RFIDtag assemblies attached to the product containers may define themicroingredient within the product container.

Accordingly, if a pump assembly/tubing assembly that was used forlemon-lime flavoring is now going to be used for root beer flavoring,the service technician may be given a warning asking them to confirmthat this is what they want to do. However, if a pump assembly/tubingassembly that was used for root beer flavoring is now going to be usedfor lemon-lime flavoring, the service technician may be provided with awarning explaining that they cannot proceed and must switch the productcontainers back to their original configurations or e.g., have thecompromised pump assembly/tubing assembly removed and replaced with avirgin pump assembly/tubing assembly. Similar warnings may be providedin the event that RFID subsystem 474 detects that a bracket assembly hasbeen moved within processing system 10.

RFID subsystem 474 may be configured to monitor the consumption of thevarious microingredients. For example and as discussed above, an RFIDtag assembly may be initially encoded to define the quantity ofmicroingredient within a particular product container. As control logicsubsystem 14 knows the amount of microingredient pumped from each of thevarious product containers, at predefined intervals (e.g. hourly), thevarious RFID tag assemblies included within the various productcontainers may be rewritten by RFID subsystem 474 (via an RFID antennaassembly) to define an up-to-date quantity for the microingredientincluded within the product container.

Upon detecting that a product container has reached a predeterminedminimum quantity, RFID subsystem 474, via control logic subsystem 14,may render a warning message on informational screen 414 ofuser-interface subsystem 22. Additionally, RFID subsystem 474 mayprovide a warning (via informational screen 414 of user-interfacesubsystem 22) in the event that one or more product containers hasreached or exceeded an expiration date (as defined within an RFID tagassembly attached to the product container). Additionally/alternatively,the above-described warning message may be transmitted to a remotecomputer (not shown), such as a remote server that is coupled (via awireless or wired communication channel) to processing system 10.

While RFID system 450 is described above as having an RFID antennaassembly affixed to a product module and RFID tag assemblies affixed tobracket assemblies and product containers, this is for illustrativepurposes only and is not intended to be a limitation of this disclosure.Specifically, the RFID antenna assembly may be positioned on any productcontainer, a bracket assembly, or product module. Additionally, the RFIDtag assemblies may be positioned on any product container, bracketassembly, or product module. Accordingly, in the event that an RFID tagassembly is affixed to a product module assembly, the RFID tag assemblymay define a product module identifier that e.g. defines a serial numberfor the product module.

Referring also to FIG. 8B, there is shown one implementation of RFIDsubsystem 474 included within RFID system 450. RFID subsystem 474 may beconfigured to allow a single RFID reader 478 (also included within RFIDsubsystem 474) to sequentially energize a plurality of RFID antennaassemblies (e.g., RFID antenna assemblies 452, 462, 464, 466).

During a scanning period, RFID system 450 may select Port1 on Switch4(i.e., the port coupled to Switch1) and sequentially cycle Switch1 toselect Port1, then Port2, then Port3, and then Port4; thus sequentiallyenergizing RFID antenna assemblies 466, 464, 462, 452 and reading anyRFID tag assemblies positioned proximate the energized RFID antennaassemblies.

During the next scanning period, RFID system 450 may select Port2 onSwitch4 (i.e., the port coupled to Switch2) and sequentially cycleSwitch2 to select Port1, then Port2, then Port3, and then Port4; thussequentially energizing the RFID antenna assemblies (coupled to Switch2)and reading any RFID tag assemblies positioned proximate the energizedRFID antenna assemblies.

During the next scanning period, RFID system 450 may select Port3 onSwitch4 (i.e., the port coupled to Switch3) and sequentially cycleSwitch3 to select Port1, then Port2, then Port3, and then Port4; thussequentially energizing the RFID antenna assemblies (coupled to Switch3)and reading any RFID tag assemblies positioned proximate the energizedRFID antenna assemblies.

One or more ports of Switch4 (e.g., Port4) may be coupled to auxiliaryconnector 480 (e.g., a releasable coaxial connector) that allowsauxiliary device 482 to be releasably coupled to auxiliary connector480. Examples of auxiliary device 482 may include but are not limited toan RFID reader and a handheld antenna. During any scanning period inwhich RFID system 450 selects Port4 on Switch4 (i.e., the port coupledto auxiliary connector 480), the device releasably coupled to auxiliaryconnector 480 may be energized. Examples of Switch1, Switch2, Switch3and Switch4 may include but are not limited to single pole, quadruplethrow electrically-selectable switches.

Due to the close proximity of the slot assemblies (e.g., slot assemblies260, 262, 264, 266) included within product module assembly 250, it maybe desirable to configure RFID antenna assembly 452 in a manner thatallows it to avoid reading e.g., product containers positioned withinadjacent slot assemblies. For example, RFID antenna assembly 452 shouldbe configured so that RFID antenna assembly 452 can only read RFID tagassemblies 454, 458; RFID antenna assembly 462 should be configured sothat RFID antenna assembly 462 can only read RFID tag assembly 468 andthe RFID tag assembly (not shown) affixed to product container 256; RFIDantenna assembly 464 should be configured so that RFID antenna assembly464 can only read RFID tag assembly 470 and the RFID tag assembly (notshown) affixed to product container 254; and RFID antenna assembly 466should be configured so that RFID antenna assembly 466 can only readRFID tag assembly 472 and the RFID tag assembly (not shown) affixed toproduct container 252.

Accordingly and referring also to FIG. 9, one or more of RFID antennaassemblies 452, 462, 464, 466 may be configured as a loop antenna. Whilethe following discussion is directed towards RFID antenna assembly 452,this is for illustrative purposes only and is not intended to be alimitation of this disclosure, as the following discussion may beequally applied to RFID antenna assemblies 462, 464, 466.

RFID antenna assembly 452 may include first capacitor assembly 500(e.g., a 2.90 pF capacitor) that is coupled between ground 502 and port504 that may energize RFID antenna assembly 452. A second capacitorassembly 506 (e.g., a 2.55 pF capacitor) maybe positioned between port504 and inductive loop assembly 508. Resistor assembly 510 (e.g., a 2.00Ohm resistor) may couple inductive loop assembly 508 with ground 502while providing a reduction in the Q factor (also referred to herein as“de-Qing”) to increase the bandwidth and provide a wider range ofoperation.

As is known in the art, the characteristics of RFID antenna assembly 452may be adjusted by altering the physical characteristics of inductiveloop assembly 508. For example, as the diameter “d” of inductive loopassembly 508 increases, the far field performance of RFID antennaassembly 452 may increase. Further, as the diameter “d” of inductiveloop assembly 508 decreases; the far field performance of RFID antennaassembly 452 may decrease.

Specifically, the far field performance of RFID antenna assembly 452 mayvary depending upon the ability of RFID antenna assembly 452 to radiateenergy. As is known in the art, the ability of RFID antenna assembly 452to radiate energy may be dependent upon the circumference of inductiveloop assembly 508 (with respect to the wavelength of carrier signal 512used to energize RFID antenna assembly 452 via port 504.

Referring also to FIG. 10 and in a preferred embodiment, carrier signal512 may be a 915 MHz carrier signal having a wavelength of 12.89 inches.With respect to loop antenna design, once the circumference of inductiveloop assembly 508 approaches or exceeds 50% of the wavelength of carriersignal 512, the inductive loop assembly 508 may radiate energy outwardin a radial direction (e.g., as represented by arrows 550, 552, 554,556, 558, 560) from axis 562 of inductive loop assembly 508, resultingin strong far field performance. Conversely, by maintaining thecircumference of inductive loop assembly 508 below 25% of the wavelengthof carrier signal 512, the amount of energy radiated outward byinductive loop assembly 508 will be reduced and far field performancewill be compromised. Further, magnetic coupling may occur in a directionperpendicular to the plane of inductive loop assembly 508 (asrepresented by arrows 564, 566), resulting in strong near fieldperformance.

As discussed above, due to the close proximity of slot assemblies (e.g.,slot assemblies 260, 262, 264, 266) included within product moduleassembly 250, it may be desirable to configure RFID antenna assembly 452in a manner that allows it to avoid reading e.g., product containerspositioned within adjacent slot assemblies. Accordingly, by configuringinductive loop assembly 508 so that the circumference of inductive loopassembly 508 is below 25% of the wavelength of carrier signal 512 (e.g.,3.22 inches for a 915 MHz carrier signal), far field performance may bereduced and near field performance may be enhanced. Further, bypositioning inductive loop assembly 508 so that the RFID tag assembly tobe read is either above or below RFID antenna assembly 452, the RFID tagassembly may be inductively coupled to RFID antenna assembly 452. Forexample, when configured so that the circumference of inductive loopassembly 508 is 10% of the wavelength of carrier signal 512 (e.g., 1.29inches for a 915 MHz carrier signal), the diameter of inductive loopassembly 508 would be 0.40 inches, resulting in a comparatively highlevel of near field performance and a comparatively low level of farfield performance.

Referring also to FIG. 11 A, to further reduce the possibility ofreading e.g., product containers positioned within adjacent slotassemblies, split ring resonator assembly 568 may be positionedproximate inductive loop assembly 508. For example, split ring resonatorassembly 568 may be positioned approximately 0.125 inches away frominductive loop assembly 508.

Split ring resonator assembly 568 may be generally planar and mayinclude at least one ring, and in some embodiments, a pair of concentricrings 570, 572, each of which may include a “split” (e.g., a gap) 574,576 (respectively) that may be positioned opposite each other (withrespect to split ring resonator assembly 568). Split ring resonatorassembly 568 may be positioned (with respect to inductive loop assembly508) so that split ring resonator assembly 568 may be magneticallycoupled to inductive loop assembly 508 and at least a portion of themagnetic field (as represented by arrow 566) generated by inductive loopassembly 508 may be focused to further reduce the possibility of readinge.g., product containers positioned within adjacent slot assemblies.

When split ring resonator assembly 568 is magnetically coupled toinductive loop assembly 508, the magnetic flux of the magnetic field (asrepresented in this illustrative example by arrow 566) may penetraterings 570, 572 and rotating currents (as represented by arrows 578, 580respectively) may be generated. Rotating currents 578, 580 within rings570, 572 (respectively) may produce their own lines of magnetic fluxthat may (depending on their direction) enhance the magnetic field ofinductive loop assembly 508.

For example, rotating current 578 may generate lines of magnetic flux(as represented by arrow 584) that flow in a generally perpendiculardirection inside of ring 570 (and, therefore, enhance magnetic field566). Further, rotating current 580 may generate lines of magnetic flux(as represented by arrow 588) that flow in a generally perpendiculardirection inside of ring 572 (and, therefore, enhance magnetic field566).

Accordingly, through the use of split ring resonator assembly 568,magnetic field 566 that is generated by inductive loop assembly 508 maybe generally enhanced within the area bounded by split ring resonatorassembly 568 (as represented by enhancement area 590).

When configuring split ring resonator assembly 568, rings 570, 572 maybe constructed from a non-ferrous metamaterial. An example of such anon-ferrous metamaterial is copper. As is known in the art, ametamaterial is a material in which the properties of the material aredefined by the structure of the material (as opposed to the compositionof the material).

Left-handed metamaterials may exhibit an interesting behavior ofmagnetic resonance when excited with an incident electromagnetic wave,which may be due to the physical properties of the structure. Normallyshaped as concentric split rings, the dielectric permittivity andeffective permeability of the left-handed metamaterial may becomenegative at resonance, and may form a left handed coordinate system.Further, the index of refraction may be less than zero, so the phase andgroup velocities may be oriented in opposite directions such that thedirection of propagation is reversed with respect to the direction ofenergy flow.

Accordingly, split ring resonator assembly 568 may be configured suchthat the resonant frequency of split ring resonator assembly 568 isslightly above (e.g., 5-10% greater) the frequency of carrier signal 512(i.e., the carrier signal that energizes inductive loop assembly 508).Continuing with the above-stated example in which carrier signal 512 hasa frequency of 915 MHz, split ring resonator assembly 568 may beconfigured to have a resonant frequency of approximately 950 MHz-1.00GHz, which, in some embodiments, may be desirable for may reasons,including, but not limited to, minimizing group delay distortion withinthe operating band of RFID system 478, which occurs at resonance.

Referring also to FIGS. 11B1-11B16, there are shown various flux plotdiagrams illustrative of the lines of magnetic flux produced by e.g.,inductive loop assembly 508 without and with e.g., split ring resonatorassembly 568 at various phase angles of e.g., carrier signal 512. LeftHanded Metamaterials may exhibit an interesting behavior of magneticresonance when excited with an incident electromagnetic wave, which maybe due to the physical properties of the structure. In FIGS. 11B1-11B16,a loop antenna (e.g., inductive loop assembly 508) excites a split ringresonator (e.g., split ring resonator assembly 568) and the magnetic (H)field patterns are shown for a given phase angle. As the phase angle ofe.g., carrier signal 512 is varied, the direction and density of thelines of magnetic flux may be observed concentrating within andextending from the geometric footprint of e.g., split ring resonatorassembly 568.

Specifically, FIGS. 11B1-11B2 are illustrative of the lines of magneticflux produced by e.g., inductive loop assembly 508 without and with(respectively) e.g., split ring resonator assembly 568 at a 0 degreephase angle of e.g., carrier signal 512. FIGS. 11B3-11B4 areillustrative of the lines of magnetic flux produced by e.g., inductiveloop assembly 508 without and with (respectively) e.g., split ringresonator assembly 568 at a 45 degree phase angle of e.g., carriersignal 512. FIGS. 11B5-11B6 are illustrative of the lines of magneticflux produced by e.g., inductive loop assembly 508 without and with(respectively) e.g., split ring resonator assembly 568 at a 90 degreephase angle of e.g., carrier signal 512. FIGS. 11B7-11B8 areillustrative of the lines of magnetic flux produced by e.g., inductiveloop assembly 508 without and with (respectively) e.g., split ringresonator assembly 568 at a 135 degree phase angle of e.g., carriersignal 512. FIGS. 11B9-11B10 are illustrative of the lines of magneticflux produced by e.g., inductive loop assembly 508 without and with(respectively) e.g., split ring resonator assembly 568 at a 180 degreephase angle of e.g., carrier signal 512. FIGS. 11B11-11B12 areillustrative of the lines of magnetic flux produced by e.g., inductiveloop assembly 508 without and with (respectively) e.g., split ringresonator assembly 568 at a 225 degree phase angle of e.g., carriersignal 512. FIGS. 11B13-11B14 are illustrative of the lines of magneticflux produced by e.g., inductive loop assembly 508 without and with(respectively) e.g., split ring resonator assembly 568 at a 270 degreephase angle of e.g., carrier signal 512. FIGS. 11B15-11B16 areillustrative of the lines of magnetic flux produced by e.g., inductiveloop assembly 508 without and with (respectively) e.g., split ringresonator assembly 568 at a 315 degree phase angle of e.g., carriersignal 512.

Referring also to FIG. 11C, there is shown one exemplary implementationof the use of split ring resonators with RFID antenna assemblies.Specifically, product module assembly 250 is shown to include slots forfour product containers (e.g., product containers 252, 254, 256, 258).Four RFID antenna assemblies (e.g., RFID antenna assemblies 452, 462,464, 466) are affixed to product module assembly 250. One split ringresonator assembly (e.g., split ring resonator assembly 568) may bepositioned above RFID antenna assembly 452 to focus the “upper portion”of the magnetic field generated by RFID antenna assembly 452 and definee.g., enhancement area 590. In this particular example, a split ringresonator assembly (e.g., split ring resonator assembly 592) may bepositioned below RFID antenna assembly 452 to focus the “lower” portionof the magnetic field generated by RFID antenna assembly 452. Further,three additional split ring resonator assemblies (e.g., split ringresonator assemblies 594, 596, 598) may be positioned above RFID antennaassemblies 462, 464, 466 to focus the “upper portion” of the respectivemagnetic fields generated by RFID antenna assemblies 462, 464, 466 anddefine the respective enhancement area associated with each RFID antennaassembly. In some embodiments, a single split ring resonator may be usedrather than the two shown in FIG. 11C. In embodiments using a singlesplit ring resonator, the split ring resonator may be positioned eitherabove or below the RFID antenna assembly.

Referring also to FIG. 12A, when configuring split ring resonatorassembly 568, split ring resonator assembly 568 may be modeled as L-Ctank circuit 600. For example, capacitor assemblies 602, 604 may berepresentative of the capacitance of the spacing “x” (FIG. 11 A) betweenthe rings 570, 572. Capacitor assemblies 606, 608 may be representativeof the capacitance of gaps 574, 576 (respectively). Inductor assemblies610, 612 may be representative of the inductances of rings 570 572(respectively). Further, mutual inductance coupling 614 may berepresentative of the mutual inductance coupling between rings 570, 572.Accordingly, the values of capacitor assemblies 602, 604, 606, 608,inductor assemblies 610, 612, and mutual inductance coupling 614 may bechosen so that split ring resonator assembly 568 has the desiredresonant frequency.

In a preferred embodiment, the width of spacing “x” is 0.20 inches, thewidth of gap 574 is 0.20 inches, the width of gap 576 is 0.20 inches,the width “y” (FIG. 11 A) of ring 570 is 0.20 inches, and the width “z”(FIG. 11 A) of ring 572 is 0.20 inches. Further, in a preferredembodiment, capacitor assembly 602 may have a value of approximately1.00 picofarads, capacitor assembly 604 may have a value ofapproximately 1.00 picofarads, capacitor assembly 606 may have a valueof approximately 1.00 picofarads, capacitor assembly 608 may have avalue of approximately 1.00 picofarads, inductor assembly 610 may have avalue of approximately 1.00 milliHenry, inductor assembly 612 may have avalue of approximately 1.00 milliHenry, and mutual inductance coupling614 may have a value of 0.001. In some embodiments, the inductorassembly 610 may have a value of approximately 5 nanoHenry, however, invarious embodiments, this value the inductor assembly 610 may differentvalues than those stated herein.

As discussed above, it may be desirable to set the resonant frequency ofsplit ring resonator assembly 568 to be slightly above (e.g., 5-10%greater) than the frequency of carrier signal 512 (i.e., the carriersignal that energizes inductive loop assembly 508). Referring also toFIG. 12B, there is shown varactor tuning circuit 650 that is configuredto allow for e.g., tuning of the resonant frequency/varying the phaseshift/modulating response characteristics/changing the quality factor ofsplit ring resonator assembly 568. For example, varactor tuning circuit650 may be positioned within gaps 574, 576 of rings 570, 572(respectively) and may include one or more varactor diodes 652, 654(e.g., MDT MV20004), coupled anode to anode, in series with one or twocapacitors (e.g., capacitors 656, 658). In a typical embodiment,capacitors 656, 658 may have a value of approximately 10 picofarads. Apair of resistor assemblies (e.g., 660, 662) may tie the cathodes ofvaractor diodes 652, 654 (respectively) to ground 664, and inductorassembly 666 may supply a negative voltage (produced by generator 668)to the anodes of varactor diodes 652, 654. In a typical embodiment,resistor assemblies 660, 662 may have a value of approximately 100Kohms, inductor assembly 666 may have a value of approximately 20-300nanoHenry (with a range of typically 100-200 nanoHenry), and generator668 may have a value of approximately −2.5 volts. If varactor tuningcircuit 650 is configured to include a single varactor diode (e.g.,varactor diode 652), varactor diode 654 and resistor assembly 662 may beremoved for varactor tuning circuit 650 and capacitor 658 may bedirectly coupled to the anode of varactor diode 652 and inductorassembly 666.

While split ring resonator assembly 568 is shown to include a pair ofgenerally circular rings (namely rings 570, 572), this is forillustrative purposes only and is not intended to be a limitation ofthis disclosure. Specifically, the general shape of split ring resonatorassembly 568 may be varied depending on the manner in which magneticfield 566 is to be focused or a shape fashioned to create left handbehavior in a desired footprint. Additionally, in some embodiments, thesplit ring resonator assembly 568 may include a single ring.Additionally, for example, if a generally circular enhancement area isdesired, a split ring resonator assembly 568 having generally circularrings may be utilized. Alternatively, if a generally rectangularenhancement area is desired, a split ring resonator assembly 568 havinggenerally rectangular rings may be utilized (as shown in FIG. 13A).Alternatively still, if a generally square enhancement area is desired,a split ring resonator assembly 568 having generally square rings may beutilized. Additionally, if a generally oval enhancement area is desired,a split ring resonator assembly 568 having generally oval rings may beutilized.

Further, the rings utilized within split ring resonator assembly 568need not be smooth rings (as shown in FIG. 11 A) and, depending on theapplication, may include non-smooth (e.g., corrugated) surfaces. Anexample of such a corrugated ring surface is shown in FIG. 13B.

Referring also to FIGS. 14 & 15A, processing system 10 may beincorporated into housing assembly 700. Housing assembly 700 may includeone or more access doors/panels 702, 704 that e.g., allow for theservicing of processing system 10 and allow for the replacement of emptyproduct containers (e.g., product container 258). For various reasons(e.g., security, safety, etc), it may be desirable to secure accessdoors/panels 702, 704 so that the internal components of processingsystem 10 can only be accessed by authorized personnel. Accordingly, thepreviously-described RFID subsystem (i.e., RFID subsystem 474) may beconfigured so that access doors/panels 702, 704 may only be opened ifthe appropriate RFID tag assembly is positioned proximate RFID antennaassembly 750. An example of such an appropriate RFID tag assembly mayinclude an RFID tag assembly that is affixed to a product container(e.g., RFID tag assembly 454 that is affixed to product container 258).

RFID antenna assembly 750 may include multi-segment inductive loopassembly 752. A first matching component 754 (e.g., a 5.00 pF capacitor)may be coupled between ground 756 and port 758 that may energize RFIDantenna assembly 750. A second matching component 760 (e.g., a 16.56nanoHenries inductor) may be positioned between port 758 andmulti-segment inductive loop assembly 752. Matching components 754, 760may adjust the impedance of multi-segment inductive loop assembly 752 toa desired impedance (e.g., 50.00 Ohms). Generally, matching components754, 760 may improve the efficiency of RFID antenna assembly 750.

Optionally, RFID antenna assembly 750 may include a reduction in the Qfactor of element 762 (e.g., a 50 Ohm resistor) that may be configuredto allow RFID antenna assembly 750 to be utilized over a broader rangeof frequencies. This may also allow RFID antenna assembly 750 to be usedover an entire band and may also allow for tolerances within thematching network. For example, if the band of interest of RFID antennaassembly 750 is 50 MHz and reduction of Q factor element (also referredto herein as a “de-Qing element”) 762 is configured to make the antenna100 MHz wide, the center frequency of RFID antenna assembly 750 may moveby 25 MHz without affecting the performance of RFID antenna assembly750. De-Qing element 762 may be positioned within multi-segmentinductive loop assembly 752 or positioned somewhere else within RFIDantenna assembly 750.

As discussed above, by utilizing a comparatively small inductive loopassembly (e.g., inductive loop assembly 508 of FIGS. 9 & 10), far fieldperformance of an antenna assembly may be reduced and near fieldperformance may be enhanced. Unfortunately, when utilizing such a smallinductive loop assembly, the depth of the detection range of the RFIDantenna assembly is also comparatively small (e.g., typicallyproportional to the diameter of the loop). Therefore, to obtain a largerdetection range depth, a larger loop diameter may be utilized.Unfortunately and as discussed above, the use of a larger loop diametermay result in increased far field performance, and a reduction in nearfield performance.

Accordingly, multi-segment inductive loop assembly 752 may include aplurality of discrete antenna segments (e.g., antenna segments 764, 766,768, 770, 772, 774, 776), with a phase shift element (e.g., capacitorassemblies 780, 782, 784, 786, 788, 790, 792). Examples of capacitorassemblies 780, 782, 784, 786, 788, 790, 792 may include 1.0 pFcapacitors or varactors (e.g., voltage variable capacitors) for example,0.1-250 pF varactors. The above-described phase shift element may beconfigured to allow for the adaptive controlling of the phase shift ofmulti-segment inductive loop assembly 752 to compensate for varyingconditions; or for the purpose of modulating the characteristics ofmulti-segment inductive loop assembly 752 to provide for variousinductive coupling features and/or magnetic properties. An alternativeexample of the above-described phase shift element is a coupled line(not shown).

As discussed above, by maintaining the length of an antenna segmentbelow 25% of the wavelength of the carrier signal energizing RFIDantenna assembly 750, the amount of energy radiated outward by theantenna segment will be reduced, far field performance will becompromised, and near field performance will be enhanced. Accordinglyeach of antenna segments 764, 766, 768, 770, 772, 774, 776 maybe sizedso that they are no longer than 25% of the wavelength of the carriersignal energizing RFID antenna assembly 750. Further, by properly sizingeach of capacitor assemblies 780, 782, 784, 786, 788, 790, 792, anyphase shift that occurs as the carrier signal propagates aroundmulti-segment inductive loop assembly 752 may be offset by the variouscapacitor assemblies incorporated into multi-segment inductive loopassembly 752. Accordingly, assume for illustrative purposes that foreach of antenna segments 764, 766, 768, 770, 772, 774, 776, a 90° phaseshift occurs. Accordingly, by utilizing properly sized capacitorassemblies 780, 782, 784, 786, 788, 790, 792, the 90° phase shift thatoccurs during each segment may be reduced/eliminated. For example, for acarrier signal frequency of 915 MHz and an antenna segment length thatis less than 25% (and typically 10%) of the wavelength of the carriersignal, a 1.2 pF capacitor assembly may be utilized to achieve thedesired phase shift cancellation, as well as tune segment resonance.

As discussed above, by utilizing comparatively short antenna segments(e.g., antenna segments 764, 766, 768, 770, 772, 774, 776) that are nolonger than 25% of the wavelength of the carrier signal energizing RFIDantenna assembly 750, far field performance of antenna assembly 750 maybe reduced and near field performance may be enhanced.

If a higher level of far field performance is desired from RFID antennaassembly 750, RFID antenna assembly 750 may include far field antennaassembly 794 (e.g., a dipole antenna assembly) electrically coupled to aportion of multi-segment inductive loop assembly 752. Far field antennaassembly 794 may include first antenna portion 796 (i.e., forming thefirst portion of the dipole) and second antenna portion 798 (i.e.,forming the second portion of the dipole). As discussed above, bymaintaining the length of antenna segments 764, 766, 768, 770, 772, 774,776 below 25% of the wavelength of the carrier signal, far fieldperformance of antenna assembly 750 may be reduced and near fieldperformance may be enhanced. Accordingly, the sum length of firstantenna portion 796 and second antenna portion 798 may be greater than25% of the wavelength of the carrier signal, thus allowing for anenhanced level of far field performance.

While multi-segment inductive loop assembly 752 is shown as beingconstructed of a plurality of linear antenna segments coupled via miterjoints, this is for illustrative purposes only and is not intended to bea limitation of this disclosure. For example, a plurality of curvedantenna segments may be utilized to construct multi-segment inductiveloop assembly 752. Additionally, multi-segment inductive loop assembly752 may be configured to be any loop-type shape. For example,multi-segment inductive loop assembly 752 may be configured as an oval(as shown in FIG. 15A), a circle, a square, a rectangle, or an octagon.

As discussed above, split ring resonator assembly 568 (FIG. 11 A) or aplurality of split ring resonator assemblies may be positioned (withrespect to inductive loop assembly 508, FIG. 11 A) so that split ringresonator assembly 568 (FIG. 11 A) may be magnetically coupled toinductive loop assembly 508 (FIG. 11 A) and at least a portion of themagnetic field (as represented by arrow 566, FIG. 11 A) generated byinductive loop assembly 508 (FIG. 11 A) may be focused to further reducethe possibility of reading e.g., product containers positioned withinadjacent slot assemblies. Such a split ring resonator assembly may beutilized with the above-described multi-segment inductive loop assembly752 to focus the magnetic field generated by multi-segment inductiveloop assembly 752. An example of a split ring resonator assembly 800configured to be utilized with multi-segment inductive loop assembly 752is shown in FIG. 15B. The quantity of gaps included within split ringresonator 800 may be varied to tune split ring resonator 800 to thedesired resonant frequency.

Similar to the discussion of split ring resonator assembly 568, theshape of split ring resonator 800 may be varied depending on the mannerin which the magnetic field produced by multi-segment inductive loopassembly 752 is to be focused. For example, if a generally circularenhancement area is desired, a split ring resonator assembly 800 havinggenerally circular rings may be utilized. Alternatively, if a generallyrectangular enhancement area is desired, a split ring resonator assembly800 having generally rectangular rings may be utilized. Alternativelystill, if a generally square enhancement area is desired, a split ringresonator assembly 800 having generally square rings may be utilized.Additionally, if a generally oval enhancement area is desired, a splitring resonator assembly 800 having generally oval rings may be utilized(as shown in FIG. 15B).

Eddy Current Trap

Referring now to FIGS. 18A and 18B, a board 1100 is shown with two loopantennas 1102, 1104 and an Eddy Current Trap 1106 therebetween. FIG. 18Bshows an electrical schematic of one embodiment of the Eddy Current Trap1106. The Eddy Current Trap 1106 may include a ground plane 1110, ade-Qing resistor 1112, a capacitive gap 1114 and an inductive trace1108.

In some embodiments of the various embodiments of the antenna, inbetween two loop antennas 1102, 1104, an Eddy Current Trap 1106 may beinstalled/positioned. Thus, in some embodiments, an Eddy Current Trap1106 may be installed/positioned at a predetermined distance from theloop antennas 1102, 1104. An Eddy Current Trap 1106 is a resonant tankcircuit that absorbs electromagnetic field patterns from the loopantennas 1102, 1104. In some embodiments, the Eddy Current Trap 1106 maybe implemented either in lumped element or distributed components, or acombination of the two. The Eddy Current Trap 1106 may be used toimprove the isolation between the loop antennas 1102, 1104. In someembodiments, as shown in FIG. 19, at least one split ring resonator1116, 1118 may be printed on the opposite side of the board shown inFIG. 18. However, in some embodiments, the at least one split ringresonator 1116, 1118 may be printed on a separate board.

In some embodiments, as in the embodiment shown in FIG. 19, the splitring resonator 1116, 1118 is a single ring. However, in otherembodiments, the split ring resonator 1116, 1118 may be any of theembodiments of split ring resonators described herein. In someembodiments, one or more de-Qing elements 1112 may be used to improvebroadband response.

Referring now to FIGS. 20A-20E, various results are shown. In FIG. 20A,a reference calibration is shown. This is a calibration showing theisolation between the two loop antennas, according to one embodiment. InFIG. 20B, an Eddy Current Trap has been installed and the isolationbetween the two loop antennas is measured. FIG. 20B shows theimprovement in isolation between the two loop antennas. In FIGS.20C-20E, various De-Qing resistors were installed (e.g., a 2 ohn, FIG.20C, 5 ohm, 20D and 10 ohm, 20E resistor respectively) and an improvedbroadband response is shown. In FIG. 20F, results from anelectromagnetic simulation are shown. A 3D plot of a 2D plane is shown.This shows the magnetic field currents in amps per meter. The plots showthe amount of energy trapped in the Eddy Current Trap. The results showa comparison with and without the Eddy Current Trap. Finally, FIG.20E-20G show resulting isoline plots from electromagnetic simulationsperformed and shows the amount of energy trapped in the Eddy CurrentTrap, see FIG. 20G, whereas FIG. 20F is the result without an EddyCurrent Trap.

Referring now to FIG. 21, another embodiment of a loop antenna is shown.This embodiment of the loop antenna may be used with any of the varioussystems described herein. The loop antenna shown in FIG. 21 is oneembodiment of a loop antenna and various embodiments may vary.

Referring also to FIG. 16A, there is shown a preferred embodiment RFIDantenna assembly 950 that may be configured to effectuate the opening ofaccess doors/panels 702, 704 (FIG. 14).

RFID antenna assembly 950 may include multi-segment inductive loopassembly 952. A first matching component 954 (e.g., a 5.00 pF capacitor)may be coupled between ground 956 and port 958 that may energize RFIDantenna assembly 950. A second matching component 960 (e.g., a 5.00 pFcapacitor) may be positioned between port 958 and multi-segmentinductive loop assembly 952. Matching components 954, 960 may adjust theimpedance of multi-segment inductive loop assembly 952 to a desiredimpedance (e.g., 50.00 Ohms). Generally, matching components 954, 960may improve the efficiency of RFID antenna assembly 950.

RFID antenna assembly 950 may include resistive element 962 (e.g., a 50Ohm resistor) that may be configured to tune RFID antenna assembly 750.Resistive element 962 may be positioned within multi-segment inductiveloop assembly 952 or positioned somewhere else within RFID antennaassembly 950.

Multi-segment inductive loop assembly 952 may include a plurality ofdiscrete antenna segments (e.g., antenna segments 964, 966, 968, 970,972, 974, 976), with a phase shift element (e.g., capacitor assemblies980, 982, 984, 986, 988, 990, 992). Examples of capacitor assemblies980, 982, 984, 986, 988, 990, 992 may include 1.0 pF capacitors orvaractors (e.g., voltage variable capacitors) for example, 0.1-250 pFvaractors. The above-described phase shift element may be configured toallow for the adaptive controlling of the phase shift of multi-segmentinductive loop assembly 952 to compensate for varying conditions; or forthe purpose of modulating the characteristics of multi-segment inductiveloop assembly 952 to provide for various inductive coupling featuresand/or magnetic properties. In some embodiments, an alternative exampleof the above-described phase shift element may be a coupled line (notshown).

As discussed above, by maintaining the length of an antenna segmentbelow 25% of the wavelength of the carrier signal energizing RFIDantenna assembly 750, the amount of energy radiated outward by theantenna segment will be reduced, far field performance will becompromised, and near field performance will be enhanced. Accordinglyeach of antenna segments 964, 966, 968, 970, 972, 974, 976 may be sizedso that they are no longer than 25% of the wavelength of the carriersignal energizing RFID antenna assembly 950. Further, by properly sizingeach of capacitor assemblies 980, 982, 984, 986, 988, 990, 992, anyphase shift that occurs as the carrier signal propagates aroundmulti-segment inductive loop assembly 952 may be offset by the variouscapacitor assemblies incorporated into multi-segment inductive loopassembly 952. Accordingly, assume for illustrative purposes that foreach of antenna segments 964, 966, 968, 970, 972, 974, 976, a 90° phaseshift occurs. Accordingly, by utilizing properly sized capacitorassemblies 980, 982, 984, 986, 988, 990, 992, the 90° phase shift thatoccurs during each segment may be reduced/eliminated. For example, for acarrier signal frequency of 915 MHz and an antenna segment length thatis less than 25% (and typically 10%) of the wavelength of the carriersignal, a 1.2 pF capacitor assembly may be utilized to achieve thedesired phase shift cancellation, as well as tune segment resonance.

As discussed above, by utilizing comparatively short antenna segments(e.g., antenna segments 964, 966, 968, 970, 972, 974, 976) that are nolonger than 25% of the wavelength of the carrier signal energizing RFIDantenna assembly 950, far field performance of antenna assembly 950 maybe reduced and near field performance may be enhanced.

If a higher level of far field performance is desired from RFID antennaassembly 950, RFID antenna assembly 950 may include far field antennaassembly 994 (e.g., a dipole antenna assembly) electrically coupled to aportion of multi-segment inductive loop assembly 952. Far field antennaassembly 994 may include first antenna portion 996 (i.e., forming thefirst portion of the dipole) and second antenna portion 998 (i.e.,forming the second portion of the dipole). As discussed above, bymaintaining the length of antenna segments 964, 966, 968, 970, 972, 974,976 below 25% of the wavelength of the carrier signal, far fieldperformance of antenna assembly 950 may be reduced and near fieldperformance may be enhanced. Accordingly, the sum length of firstantenna portion 996 and second antenna portion 998 may be greater than25% of the wavelength of the carrier signal, thus allowing for anenhanced level of far field performance.

While multi-segment inductive loop assembly 952 is shown as beingconstructed of a plurality of linear antenna segments coupled via miterjoints, this is for illustrative purposes only and is not intended to bea limitation of this disclosure. For example, a plurality of curvedantenna segments may be utilized to construct multi-segment inductiveloop assembly 952. Additionally, multi-segment inductive loop assembly952 may be configured to be any loop-type shape. For example,multi-segment inductive loop assembly 952 may be configured as anoctagon (as shown in FIG. 16A), a circle, a square, a rectangle, or anoctagon.

As discussed above, split ring resonator assembly 568 (FIG. 11 A) or aplurality of split ring resonator assemblies may be positioned (withrespect to inductive loop assembly 508, FIG. 11 A) so that split ringresonator assembly 568 (FIG. 11 A) may be magnetically coupled toinductive loop assembly 508 (FIG. 11 A) and at least a portion of themagnetic field (as represented by arrow 566, FIG. 11 A) generated byinductive loop assembly 508 (FIG. 11 A) may be focused to further reducethe possibility of reading e.g., product containers positioned withinadjacent slot assemblies. Such a split ring resonator assembly may beutilized with the above-described multi-segment inductive loop assembly952 to focus the magnetic field generated by multi-segment inductiveloop assembly 952. An example of a split ring resonator assembly 1000configured to be utilized with multi-segment inductive loop assembly 952is shown in FIG. 16B. The quantity of gaps included within split ringresonator 1000 may be varied to tune split ring resonator 1000 to thedesired resonant frequency. As discussed above, it may be desirable toset the resonant frequency of split ring resonator assembly 1000 to beslightly above (e.g., 5-10% greater) than the frequency of carriersignal 512 (i.e., the carrier signal that energizes inductive loopassembly 952). Referring also to FIG. 12B, there is shown varactortuning circuit 650 that is configured to allow for e.g., tuning of theresonant frequency/varying the phase shift/modulating responsecharacteristics/changing the quality factor of split ring resonatorassembly 1000. For example, varactor tuning circuit 650 may bepositioned within gaps of rings, shown in resonator 1000, and mayinclude one or more varactor diodes 652, 654 (e.g., MDT MV20004),coupled anode to anode, in series with one or two capacitors (e.g.,capacitors 656, 658). In a typical embodiment, capacitors 656, 658 mayhave a value of approximately 10 picofarads. A pair of resistorassemblies (e.g., 660, 662) may tie the cathodes of varactor diodes 652,654 (respectively) to ground 664, and inductor assembly 666 may supply anegative voltage (produced by generator 668) to the anodes of varactordiodes 652, 654. In a typical embodiment, resistor assemblies 660, 662may have a value of approximately 100K ohms, inductor assembly 666 mayhave a value of approximately 20-300 nanoHenry (with a range oftypically 100-200 nanoHenry), and generator 668 may have a value ofapproximately −2.5 volts. If varactor tuning circuit 650 is configuredto include a single varactor diode (e.g., varactor diode 652), varactordiode 654 and resistor assembly 662 may be removed for varactor tuningcircuit 650 and capacitor 658 may be directly coupled to the anode ofvaractor diode 652 and inductor assembly 666.

While the system is described above as having the RFID tag assembly(e.g., RFID tag assembly 454) that is affixed to the product container(e.g., product container 258) positioned above the RFID antenna assembly(e.g., RFID antenna assembly 452), which is positioned above the RFIDtag (e.g., RFID tag assembly 458) that is affixed to bracket assembly282, this for illustrative purposes only and is not intended to be alimitation of this disclosure, as other configurations are possible. Forexample, the RFID tag assembly (e.g., RFID tag assembly 454) that isaffixed to the product container (e.g., product container 258) may bepositioned below the RFID antenna assembly (e.g., RFID antenna assembly452), which may be positioned below the RFID tag (e.g., RFID tagassembly 458) that is affixed to bracket assembly 282.

While the various electrical components, mechanical components,electromechanical components, and software processes are described aboveas being utilized within a processing system that dispenses beverages,this is for illustrative purposes only and is not intended to be alimitation of this disclosure, as other configurations are possible. Forexample, the above-described processing system may be utilized forprocessing/dispensing other consumable products (e.g., ice cream andalcoholic drinks). Additionally, the above-described system may beutilized in areas outside of the food industry. For example, theabove-described system may be utilized for processing/dispensing:vitamins; pharmaceuticals; medical products, cleaning products;lubricants; painting/staining products; and other non-consumableliquids/semi-liquids/granular solids and/or fluids.

As discussed above, the various electrical components, mechanicalcomponents, electro-mechanical components, and software processes ofprocessing system 10 may be used in any machine in which on-demandcreation of a product from one or more substrates (also referred to as“ingredients”) is desired.

In the various embodiments, the product is created following a recipethat is programmed into the processor. As discussed above, the recipemay be updated, imported or changed by permission. A recipe may berequested by a user, or may be preprogrammed to be prepared on aschedule. The recipes may include any number of substrates oringredients and the product generated may include any number ofsubstrates or ingredients in any concentration desired.

The substrates used may be any fluid, at any concentration, or, anypowder or other solid that may be reconstituted either while the machineis creating the product or before the machine creates the product (i.e.,a “batch” of the reconstituted powder or solid may be prepared at aspecified time in preparation for metering to create additional productsor dispensing the “batch” solution as a product). In variousembodiments, two or more substrates may themselves be mixed in onemanifold, and then metered to another manifold to mix with additionalsubstrates.

Thus, in various embodiments, on demand, or prior to actual demand butat a desired time, a first manifold of a solution may be created bymetering into the manifold, according to the recipe, a first substrateand at least one additional substrate. In some embodiments, one of thesubstrates may be reconstituted, i.e., the substrate may be apowder/solid, a particular amount of which is added to a mixingmanifold. A liquid substrate may also be added to the same mixingmanifold and the powder substrate may be reconstituted in the liquid toa desired concentration. The contents of this manifold may then beprovided to e.g., another manifold or dispensed.

In some embodiments, the methods described herein may be used inconjunction with mixing on-demand dialysate, for use with peritonealdialysis or hemodialysis, according to a recipe/prescription. As isknown in the art, the composition of dialysate may include, but is notlimited to, one or more of the following: bicarbonate, sodium, calcium,potassium, chloride, dextrose, lactate, acetic acid, acetate, magnesium,glucose and hydrochloric acid.

The dialysate may be used to draw waste molecules (e.g., urea,creatinine, ions such as potassium, phosphate, etc.) and water from theblood into the dialysate through osmosis, and dialysate solutions arewell-known to those of ordinary skill in the art.

For example, a dialysate typically contains various ions such aspotassium and calcium that are similar to their natural concentration inhealthy blood. In some cases, the dialysate may contain sodiumbicarbonate, which is usually at a concentration somewhat higher thanfound in normal blood. Typically, the dialysate is prepared by mixingwater from a source of water (e.g., reverse osmosis or “RO” water) withone or more ingredients: an “acid” (which may contain various speciessuch as acetic acid, dextrose, NaCl, CaCl, KCl, MgCl, etc.), sodiumbicarbonate (NaHCOs), and/or sodium chloride (NaCl). The preparation ofdialysate, including using the appropriate concentrations of salts,osmolality, pH, and the like, is also well-known to those of ordinaryskill in the art. As discussed in detail below, the dialysate need notbe prepared in real-time, on-demand. For instance, the dialysate can bemade concurrently or prior to dialysis, and stored within a dialysatestorage vessel or the like.

In some embodiments, one or more substrates, for example, thebicarbonate, may be stored in powder form. Although for illustrative andexemplary purposes only, a powder substrate may be referred to in thisexample as “bicarbonate”, in other embodiments, anysubstrate/ingredient, in addition to, or instead of, bicarbonate, may bestored in a machine in powder form or as another solid and the processdescribed herein for reconstitution of the substrate may be used. Thebicarbonate may be stored in a “single use” container that, for example,may empty into a manifold. In some embodiments, a volume of bicarbonatemay be stored in a container and a particular volume of bicarbonate fromthe container may be metered into a manifold. In some embodiments, theentire volume of bicarbonate may be completely emptied into a manifold,i.e., to mix a large volume of dialysate.

The solution in the first manifold may be mixed in a second manifoldwith one or more additional substrates/ingredients. In addition, in someembodiments, one or more sensors (e.g., one or more conductivitysensors) may be located such that the solution mixed in the firstmanifold may be tested to ensure the intended concentration has beenreached. In some embodiments, the data from the one or more sensors maybe used in a feedback control loop to correct for errors in thesolution. For example, if the sensor data indicates the bicarbonatesolution has a concentration that is greater or less than the desiredconcentration, additional bicarbonate or RO may be added to themanifold.

In some recipes in some embodiments, one or more ingredients may bereconstituted in a manifold prior to being mixed in another manifoldwith one or more ingredients, whether those ingredients are alsoreconstituted powders/solids or liquids.

Thus, the system and methods described herein may provide a means foraccurate, on-demand production or compounding of dialysate, or othersolutions, including other solutions used for medical treatments. Insome embodiments, this system may be incorporated into a dialysismachine, such as those described in U.S. patent application Ser. No.12/072,908 filed on 27 Feb. 2008 and having a priority date of 27 Feb.2007, which is herein incorporated by reference in its entirety. Inother embodiments, this system may be incorporated into any machinewhere mixing a product, on-demand, may be desired.

Water may account for the greatest volume in dialysate, thus leading tohigh costs, space and time in transporting bags of dialysate. Theabove-described processing system 10 may prepare the dialysate in adialysis machine, or, in a stand-alone dispensing machine (e.g., on-siteat a patient's home), thus eliminating the need for shipping and storinglarge numbers of bags of dialysate. This above-described processingsystem 10 may provide a user or provider with the ability to enter theprescription desired and the above-described system may, using thesystems and methods described herein, produce the desired prescriptionon-demand and on-site (e.g., including but not limited to: a medicaltreatment center, pharmacy or a patient's home). Accordingly, thesystems and methods described herein may reduce transportation costs asthe substrates/ingredients are the only ingredient requiringshipping/delivery.

As discussed above, other examples of such products producible byprocessing system 10 may include but are not limited to: dairy-basedproducts (e.g., milkshakes, floats, malts, frappes); coffee-basedproducts (e.g., coffee, cappuccino, espresso); soda-based products(e.g., floats, soda w/fruit juice); tea-based products (e.g., iced tea,sweet tea, hot tea); water-based products (e.g., spring water, flavoredspring water, spring water w/vitamins, high-electrolyte drinks,high-carbohydrate drinks); solid-based products (e.g., trail mix,granola-based products, mixed nuts, cereal products, mixed grainproducts); medicinal products (e.g., infusible medicants, injectablemedicants, ingestible medicants); alcohol-based products (e.g., mixeddrinks, wine spritzers, soda-based alcoholic drinks, water-basedalcoholic drinks); industrial products (e.g., solvents, paints,lubricants, stains); and health/beauty aid products (e.g., shampoos,cosmetics, soaps, hair conditioners, skin treatments, topicalointments).

A number of implementations have been described. Nevertheless, it willbe understood that various modifications may be made. Accordingly, otherimplementations are within the scope of the following claims.

What is claimed is:
 1. An RFID antenna assembly configured to beenergized with a carrier signal, the RFID antenna assembly comprising:an inductive component including a multi-segment loop antenna assembly,wherein the multi-segment loop antenna assembly includes: at least afirst antenna segment including at least a first phase shift elementconfigured to reduce the phase shift of the carrier signal within the atleast a first antenna segment, and at least a second antenna segmentincluding at least a second phase shift element configured to reduce thephase shift of the carrier signal within the at least a second antennasegment, wherein the length of each antenna segment is no more than 25%of the wavelength of the carrier signal; at least one matching componentconfigured to adjust the impedance of the multi-segment loop antennaassembly; and an eddy current trap positioned a predetermined distancefrom the multi-segment loop antenna assembly.
 2. The RFID antennaassembly of claim 1 wherein the inductive component is configured to bepositioned proximate an access assembly and to allow RFID-basedactuation of the access assembly.
 3. The RFID antenna assembly of claim1 wherein at least one of the first phase shift element and the secondphase shift element includes a capacitive component.
 4. The RFID antennaassembly of claim 1 wherein the length of each antenna segment isapproximately 10% of the wavelength of the carrier signal.
 5. The RFIDantenna assembly of claim 1 wherein the at least one matching componentincludes: a first matching component configured to couple a port onwhich the carrier signal is received and a ground.
 6. The RFID antennaassembly of claim 5 wherein the first matching component includes acapacitive component.
 7. The RFID antenna assembly of claim 5 whereinthe at least one matching component includes: a second matchingcomponent configured to couple the port on which the carrier signal isreceived and the inductive component.
 8. The RFID antenna assembly ofclaim 7 wherein the second matching component includes a capacitivecomponent.
 9. An RFID antenna assembly configured to be energized with acarrier signal, the RFID antenna assembly comprising: an inductivecomponent including a loop antenna assembly, wherein the circumferenceof the loop antenna assembly is no more than 25% of the wavelength ofthe carrier signal; at least one capacitive component coupled to theinductive component; and an eddy current trap positioned a predetermineddistance from the loop antenna assembly.
 10. The RFID antenna assemblyof claim 9 wherein the inductive component is configured to bepositioned proximate a first slot assembly to detect the presence of afirst RFID tag assembly within the first slot assembly and not detectthe presence of a second RFID tag assembly within a second slot assemblythat is adjacent to the first slot assembly.
 11. The RFID antennaassembly of claim 9 wherein the circumference of the loop antennaassembly is approximately 10% of the wavelength of the carrier signal.12. The RFID antenna assembly of claim 9 wherein the at least onecapacitive component includes a first capacitive component configured tocouple a port on which the carrier signal is received and a ground. 13.The RFID antenna assembly of claim 12 wherein the at least onecapacitive component includes a second capacitive component configuredto couple the port on which the carrier signal is received and theinductive component.
 14. An RFID antenna assembly configured to beenergized with a carrier signal, the RFID antenna assembly comprising:an inductive component including a loop antenna assembly; at least onecapacitive component coupled to the inductive component; and an eddycurrent trap positioned a predetermined distance from the loop antennaassembly.
 15. The RFID antenna assembly of claim 14 wherein theinductive component is configured to be positioned proximate a firstslot assembly to detect the presence of a first RFID tag assembly withinthe first slot assembly and not detect the presence of a second RFID tagassembly within a second slot assembly that is adjacent to the firstslot assembly.
 16. The RFID antenna assembly of claim 14 wherein thecircumference of the loop antenna assembly is approximately 10% of thewavelength of the carrier signal.
 17. The RFID antenna assembly of claim14 wherein the at least one capacitive component includes a firstcapacitive component configured to couple a port on which the carriersignal is received and a ground.
 18. The RFID antenna assembly of claim14 wherein the at least one capacitive component includes a secondcapacitive component configured to couple the port on which the carriersignal is received and the inductive component.